Unlock instant, AI-driven research and patent intelligence for your innovation.

Bilayer-electrode LED chip and manufacturing method thereof

A technology of LED chips and double-layer electrodes, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as the hydrolysis of LED chip electrodes, and achieve the effects of protecting metal electrodes, improving reliability, and preventing hydrolysis.

Active Publication Date: 2017-02-15
FOSHAN NATIONSTAR SEMICON
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the electrodes of LED chips are often metals with low electrode potentials such as Cr and Al, so it is easy to cause electrode hydrolysis of LED chips during use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bilayer-electrode LED chip and manufacturing method thereof
  • Bilayer-electrode LED chip and manufacturing method thereof
  • Bilayer-electrode LED chip and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] combine Figure 1 to Figure 2d as shown, figure 1 It is a flow chart of a method for manufacturing a double-layer electrode LED chip provided in the embodiment of the present application, Figure 2a to Figure 2d for figure 1 The structural flow chart corresponding to the production method flow chart; wherein, the production method includes:

[0028] S1. Providing a substrate.

[0029] refer to Figure 2a As shown, the substrate 100 provided in the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a bilayer-electrode LED chip and a manufacturing method thereof. Due to design of a bilayer-electrode structure, a second layer of electrode forming high electrode potential is outside a first layer of electrode; furthermore, the first layer of electrode is completely covered by the second layer of electrode; therefore, hydrolysis of the first layer of electrode under electrification and weak electrolytic conditions can be effectively prevented; the reliability of the chip is improved; furthermore, a passivation layer is formed outside the second layer of electrode; water vapour in an environment or water vapour residual in an encapsulation adhesive can be further prevented from entering the chip; therefore, the metal electrode of the chip can be effectively protected; hydrolysis of the first layer of electrode or the second layer of electrode under electrification and weak electrolytic conditions can be prevented; and thus, the reliability of the chip is improved.

Description

technical field [0001] The invention relates to the field of semiconductor lighting manufacturing, in particular to an LED chip and a manufacturing method thereof. Background technique [0002] LED (Light Emitting Diode, Light Emitting Diode) is a semiconductor device that uses energy released when carriers recombine to form light. LED chips have low power consumption, pure chromaticity, long life, small size, fast response time, energy saving and environmental protection, etc. Many advantages. [0003] During the long-term lighting process of the LED chip, it reacts with water vapor in the environment or residual water vapor in the encapsulation glue, causing the electrode to hydrolyze, resulting in abnormal phenomena such as the electrode falling off of the LED chip and the voltage rising. The main cause of hydrolysis is the formation of an electrolytic cell structure between the metal electrode and water vapor, which causes the anode to lose electrons and dissolve. In t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/38H01L33/40H01L33/44
CPCH01L33/38H01L33/40H01L33/44H01L2933/0016
Inventor 徐亮何键云
Owner FOSHAN NATIONSTAR SEMICON