Cooled process tool adapters for use in substrate processing chambers

Abstract

Embodiments of a cooled process tool adapter for use in a substrate processing chamber are provided herein. In some embodiments, a cooled treatment tool adapter includes: an annular body surrounding a central opening; coolant channels disposed in the annular body; one or more features to help support a treatment tool within the central opening; an inlet and an outlet in the ring body fluidly coupled to the coolant passage; and a power connection coupled to the ring body, the power connection having a terminal to couple the ring body to a bias power supply.

Description

technical field [0001] Embodiments disclosed herein generally relate to substrate processing chambers for use in semiconductor manufacturing systems. Background technique [0002] Reliable production of sub-micron and smaller features is one of the techniques for very large scale integration (VLSI) and very large scale integration (ULSI) for next generation semiconductor devices. However, as circuit technologies continue to be miniaturized, shrinking interconnect sizes in VLSI and ULSI technologies has placed additional demands on processing power. For example, as the circuit density of next-generation devices increases, the width of interconnects (such as vias, trenches, contacts, gate structures and other features and the dielectric material between them) decreases, while the width of the dielectric layer decreases. The thickness remains substantially constant, resulting in an increase in the aspect ratio of the feature. [0003] Sputtering, also known as physical vapor ...

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Problems solved by technology

However, the inventors have noted that providing an electrical bias for the collimator requires electrically insulating the collimator from grounded surfaces of the processing chamber, thereby undesirably resulting in thermal isolation and excessive heating of the collimator, which further results in reduced processing chamber office hours

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