Gas reaction cavity for preparing YBCO strip by MOCVD
A gas reaction chamber and reaction technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problems of low utilization rate of metal organic sources, uneven temperature field distribution, uneven film thickness, etc. Guarantee out-of-plane uniformity and consistency, improve utilization, and achieve the effect of small diffusion space
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[0021] The present invention will be further described below in conjunction with drawings and embodiments.
[0022] figure 1 The slender copper tube in the middle of the reaction chamber is the reaction tube, and the metal substrate baseband deposits thin films in it. The reaction copper tube is wound with a copper conduction belt and connected to the condensation tube outside the reaction chamber. The metal substrate baseband itself is heated by current, and the resulting heat radiation makes the temperature in the reaction copper tube very high. Because copper has good Thermal conductivity, in order to prevent the metal-organic source from reacting before reaching the surface of the substrate base tape, the copper conduction tape can conduct excessive heat to the condenser pipe, effectively inhibiting this from happening. Two copper hoses (10, 11) are respectively connected to the evaporation tube in the MOCVD equipment and the exhaust pipe connected to the vacuum pump. Acc...
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