Plant blade bionic pulsation heat pipe
A technology for pulsating heat pipes and plant leaves, which is applied in the field of bionic pulsating heat pipes for plant leaves, can solve the problems of fatigue damage, failure of electronic components, high temperature of electronic components, etc., and achieves the effect of reducing heat transfer thermal resistance and flow resistance.
Active Publication Date: 2017-02-22
NANCHANG UNIV
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Problems solved by technology
For the narrow internal space of electronic devices, high heat flux density will cause local or overall high temperature of electronic devices, which will degrade the performance of electronic devices in light cases, and cause thermal deformation in severe cases, resulting in fatigue damage or failure of electronic components
Method used
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[0017] The present invention is described as follows in conjunction with accompanying drawing:
[0018] The figure shows the structure of the bionic pulsating heat pipe of the present invention: evaporator, fins, link hoop, liquid injection nozzle, nozzle structure, heat insulation section, condensation section, and evaporation section.
[0019] The evaporation section and the heat insulation section are connected by a threaded link hoop, which is beneficial to the installation and mass production of the pulsating heat pipe;
[0020] In the present invention, the pulsating heat pipe is first vacuumed from the liquid injection nozzle, and then a certain volume of working fluid is injected to make the filling rate 70%, and then the liquid injection nozzle is closed;
[0021] After heating the evaporating section, the bionic micro-channels of the evaporator disperse the micro-channels to each heat dissipation area and re-converge. Considering that the dispersion and convergence ...
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The invention provides a plant blade bionic pulsation heat pipe which comprises a condensation section, a heat insulation section and an evaporation section. The evaporation section comprises an evaporator and a pipeline. The condensation section comprises fins and a pipeline. The specific structure of the bionic pulsation heat pipe comprises the evaporator, the fins, a connecting hoop, a liquid filling nozzle, a spraying pipe structure, the heat insulation section, the condensation section and the evaporation section. Bionic micro-channels of the evaporator are dispersed to all heat-dissipating areas and converged again. The left side and the right side of each bionic micro-channel can be of a mirror image structure, accordingly, the single-layer bionic micro-channels are simplified to be of a mirror image symmetry structure symmetric along two diagonal lines of a square, by means of the two diagonal lines of the square, a heat source area is divided into four isometrical triangle areas, the topological structures of one sides of the double-layer bionic micro-channels are adjusted to be symmetrical about the mirror image along the two diagonal lines of the square, and the bionic micro-channels are adjusted to be communicated. According to the plant blade bionic pulsation heat pipe, separation of steam and liquid can be achieved, and the steam generated by heating can flow upwards into a thick pipeline fast under the effect of the density difference.
Description
technical field [0001] The invention relates to a bionic pulsating heat pipe for plant blades, which belongs to the field of thermal equipment and is applied to high-efficiency heat dissipation and cooling of semiconductors and microelectronics. Background technique [0002] With the rapid development of the electronics industry, the performance of electronic devices is getting better and better, and the degree of integration is getting higher and higher, and the power that electronic components can generate per unit area is correspondingly increasing. For the narrow internal space of electronic devices, high heat flux density will cause local or overall high temperature of electronic devices, which will degrade the performance of electronic devices in light cases, and cause thermal deformation in severe cases, resulting in fatigue damage or failure of electronic components. This is the problem of heat dissipation between integrated components has become one of the bottlenec...
Claims
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IPC IPC(8): F28D15/04
CPCF28D15/043F28D2021/0029
Inventor 张莹胡伟强李培生王志强李伟柳阿亮鲍允州叶文林林圣享
Owner NANCHANG UNIV