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Chemical mechanical grinding device and method

A chemical machinery and grinding device technology, applied in grinding devices, abrasive surface adjustment devices, grinding machine tools, etc., can solve problems such as separation of new and old grinding fluids, reduce usage, improve grinding efficiency and quality, and improve uniformity. Effect

Active Publication Date: 2017-03-08
POWERCHIP SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the current chemical mechanical polishing device cannot effectively separate the new and old grinding liquid, how to provide a chemical mechanical grinding device and method that can effectively separate the new and old grinding liquid, thereby reducing defects and improving grinding efficiency and quality will be become an important subject

Method used

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  • Chemical mechanical grinding device and method
  • Chemical mechanical grinding device and method
  • Chemical mechanical grinding device and method

Examples

Experimental program
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Embodiment Construction

[0041] figure 1 It is a schematic top view of a chemical mechanical polishing device according to an embodiment of the present invention. figure 2 for figure 1 A schematic cross-sectional view of line A-A'. image 3 for figure 1 Schematic perspective view of the separator. Figure 4 for image 3 A schematic perspective view of the second surface of .

[0042] Please refer to figure 1 and figure 2 , the present embodiment provides a chemical mechanical polishing device 10 comprising: a polishing table 100 , a polishing pad 102 , a polishing head 104 , a regulator 106 , a polishing liquid supply device 116 and a separator 110 . The polishing pad 102 is disposed on the polishing table 100 for polishing the wafer W. The polishing table 100 drives the polishing pad 102 to rotate along the first direction D1 through a rotating shaft (not shown), and is equipped with various polishing liquids to planarize the wafer W or semiconductor manufacturing process. Structure, chemi...

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Abstract

The invention discloses a chemical mechanical grinding device and a method. The chemical mechanical grinding device comprises a grinding table, a grinding cushion, a grinding head, a regulator, a grinding liquid supply device and a separator, wherein the grinding cushion is disposed on the grinding table; the grinding head and the regulator are disposed on the grinding cushion; the separator is disposed between the grinding head and the regulator; a first end of the separator is close to the circle center of the grinding cushion, and a second end of the separator is close to the circle circumference of the grinding cushion; the separator comprises an injection part and an opening part; the injection part is close to the first end of the separator and is connected to the grinding liquid supply device; and the opening part is disposed between the injection part and the grinding cushion, and used to coat a grinding liquid on the grinding cushion.

Description

technical field [0001] The present invention relates to a chemical mechanical grinding device and method, and in particular to a chemical mechanical grinding device and method with a separator. Background technique [0002] The chemical mechanical polishing (Chemical Mechanical Polish) production process is mainly to use the tiny abrasive particles contained in the polishing liquid to rub against the surface of the chip to generate mechanical stress, and to add corresponding chemical additives to the polishing liquid according to different chip surfaces to remove Remove the part to be removed on the surface of the chip, so as to achieve the effect of enhanced grinding and selective grinding. [0003] As the size of semiconductor devices shrinks, the requirements for defects and grinding quality become increasingly stringent. The polishing liquid supply device of the current chemical mechanical polishing device can only inject the polishing liquid on the polishing pad at a s...

Claims

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Application Information

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IPC IPC(8): B24B37/10B24B53/017B24B57/02H01L21/02
CPCB24B37/10B24B53/017B24B57/02H01L21/02H01L21/02013
Inventor 曾国龙陈义元
Owner POWERCHIP SEMICON MFG CORP
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