A reel-to-reel transfer system for multi-node detection of chip components

Abstract

The invention belongs to the related field of electronic packaging equipment, and discloses a roll-to-roll transfer system oriented to multi-node detection of chip components. The roll-to-roll transfer system comprises a base, and a material roll conveying device, an element pickup device, a clamping device and an up-looking detection device which are installed on the base, wherein the material roll conveying device is used for feeding materials in a roll-to-roll manner, and performing film uncovering and film covering processing on the chip components during the feeding process; the element pickup device is used for picking up the chip components, transferring the chip components to the clamping device for detection, returning and placing the chip components back to a material strip trough, and adopting a down-looking observation camera for photographing the chip components in a down-looking pose; and the up-looking detection device is used for photographing the chip components in an up-looking pose cooperatively. The invention further discloses an optimization processing algorithm and a comprehensive evaluation algorithm of links of position compensation. The roll-to-roll transfer system can ensure the effect of realizing the pickup, returning and placing operations of the chip components in the continuous detection process, and has the advantages of high efficiency, high precision and the like.

Description

technical field [0001] The invention belongs to the related field of electronic packaging equipment, and more specifically relates to a reel-to-reel transfer system for multi-node detection of chip components. Background technique [0002] Component Surface Mount Technology (SMT) is the mainstream technology of electronic manufacturing. To ensure its process refinement and high product reliability, it is inseparable from high-quality and high-efficiency detection technology. In the entire SMT assembly process from the on-line of the mounted components to the off-line of the assembly, the inspection is mainly set at three main nodes: the inspection of incoming materials before assembly, the inspection during assembly, and the inspection of components after assembly. [0003] In the prior art, most of the electronic component detection schemes in the incoming material detection link are designed from the perspective of detection function and structural composition. For exampl...

AI Technical Summary

Problems solved by technology

However, this technical solution mainly proposes the corresponding structural composition from the perspective of satisfying component sampling inspection and counting, but does not provide specific implementation methods involving precise positioning and transfer of components in the detection process.

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