Novel support joint applicable to solar silicon wafer equipment

A solar silicon wafer, a new type of technology, applied in the field of support joint materials, can solve the problems of easy dislocation of silicon wafers, insufficient high temperature resistance, poor alkali resistance of PC, etc., to reduce the impact force of silicon wafer collision, enhance wear resistance and Lifespan and the effect of increasing the lifespan

Inactive Publication Date: 2017-03-22
苏州勤力来工业部件有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these two materials have their specific strengths, they are not ideal for use in this area.
The reason is that PC has poor alkali resistance and is not durable; PA has insufficient high temperature resistance and insufficient dimensional stability, which causes the silicon chip between the input ring and the ring to be easily dislocated and damaged.

Method used

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Effect test

Embodiment Construction

[0021] The invention is a new type of support joint suitable for solar silicon wafer equipment, comprising the following components: 40-60 parts of polyphenylene sulfide, 6-9 parts of ABS resin, 0.1-2 parts of toughening agent, compatibilizer 0.5-1.5 parts, 0.5-5 parts of coupling agent, 0.1-0.5 parts of lubricant, 0.1-0.5 parts of antioxidant and 30-50 parts of glass fiber.

[0022] Preferably 50 parts of polyphenylene sulfide, 7.5 parts of ABS resin, 1 part of toughening agent, 1 part of compatibilizer, 3 parts of coupling agent, 0.3 parts of lubricant, 0.3 parts of antioxidant and 40 parts of glass fiber.

[0023] The glass fibers are short glass fibers.

[0024] The toughening agent is one or both of EPDM and MBS.

[0025] The compatibilizer is one or more of SAG-001, SAG-002, SAG-005, SAG-008 and SBG-001.

[0026] The coupling agent is one or more of KH-560, KH-570, and hexamethyldisilazane.

[0027] The lubricant is one or more of silicone, polyethylene wax, calcium s...

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Abstract

The invention discloses a novel support joint applicable to solar silicon wafer equipment. The support joint comprises the following components: 40-60 parts of polyphenyl thioether, 6-9 parts of ABS (acrylonitrile-butadiene-styrene) resin, 0.1-2 parts of toughener, 0.5-1.5 parts of compatilizer, 0.5-5 parts of coupling agent, 0.1-0.5 part of lubricant, 0.1-0.5 part of antioxidant and 30-50 parts of glass fiber. According to the invention, the support joint is made of PPS+GF40, thereby solving the dimensional stability problem and reducing the problem that silicon wafers are damaged due to collision during suspension basket feeding; the support joint is adapted to a high drying temperature, and no deformation or dimensional variation of the support joint is caused, so that the service life is greatly prolonged; the support joint is adapted to being soaked in an alkaline cleaning solution without being corroded, thereby prolonging the service life; and 40% of glass fiber is added, thereby enhancing the dimensional stability and improving the wear resistance and service life.

Description

[0001] Technical field: [0002] The invention relates to a support joint material, in particular to a novel support joint suitable for solar silicon chip equipment. [0003] Background technique: [0004] Chips made of silicon wafers are known as "magic operators" with amazing computing power. No matter how complicated the math problem, physics problem or engineering problem is, and no matter how much calculation workload is, as long as the staff tell it the problem through the computer keyboard, and issue the ideas and instructions to solve the problem, the computer can solve the problem in a very short time I will tell you the answer. In this way, problems that would take years or decades to calculate manually may be solved by a computer in minutes. Even for some problems that human beings cannot calculate the results, the computer can quickly tell you the answer. [0005] The chip is again a modern miniature "knowledge base" with such fabulous storage capacity that a 24-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08L55/02C08L23/16C08L51/04C08K13/02C08K7/14C08K5/5435C08K5/5425
CPCC08L81/02C08L2203/20C08L2205/03C08L2205/035C08L55/02C08L23/16C08L51/04C08K13/02C08K7/14C08K5/5435C08K5/5425
Inventor 黄溪平
Owner 苏州勤力来工业部件有限公司
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