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Radiator with chip heating function

A heat sink and chip technology, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of low difficulty in production and processing, unstable startup performance of chips at low temperature, etc., and achieve low production and processing difficulty and solve The low-temperature start-up performance is extremely unstable, which is conducive to the effect of mass production

Pending Publication Date: 2017-03-22
ZHUHAI JGALAXY THERMAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned technical problems in the prior art, the present invention provides a chip heating function, which effectively solves the problem of extremely unstable low-temperature start-up performance of the existing chip, and has a simple structure and low difficulty in production and processing, which is beneficial to Radiators for retrofitting existing radiators

Method used

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  • Radiator with chip heating function
  • Radiator with chip heating function
  • Radiator with chip heating function

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Experimental program
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Effect test

Embodiment 1

[0022] Such as Figure 1 to Figure 3 As shown in , Embodiment 1 of the present invention provides a heat sink with a chip heating function, including a heat sink body 1 and a chip pre-heating unit 2, and the chip pre-heating unit 2 is installed and fixed on the heat sink body 1 and the chip Contact the bottom surface of the connection. Wherein, the chip preheating unit 2 can be a heating film, on which there is an avoidance hole 21 for chip embedding, and the shape and size of the avoidance hole 21 match the chip; the specific structure can be: the chip preheating Unit 2 is square (also can be other shapes, such as circle), and described avoidance hole 21 is arranged on the center of chip preheating unit 2, and whole chip preheating unit 2 is annular; Described chip preheating unit 2 adopts The way of pasting (such as pasting with double-sided tape) is fixed on the bottom surface of the radiator body 1 .

[0023] In addition, the power line 22 of the chip preheating unit 2 c...

Embodiment 2 3

[0026] Such as Figure 4 with 5 As shown in , Embodiments 2 and 3 of the present invention provide a heat sink with a chip heating function, including a heat sink body 1 and a chip preheating unit 2, and the chip preheating unit 2 is installed and fixed on the heat sink body 1 The bottom surface of the contact connection with the chip. Wherein, the chip pre-heating unit 2 may be a heating film, on which there is an avoidance hole 21 for chip embedding, and the shape and size of the avoidance hole 21 match the chip. The only difference is that the escape hole 21 is an avoidance notch connected with the edge of the chip preheating unit 2 and is in the shape of a concave frame.

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Abstract

The invention relates to a radiator with a chip heating function. The radiator comprises a radiator body and a chip preheating unit, wherein the chip preheating unit is mounted and fixed on the bottom surface, in contact and connection with a chip, of the radiator body, so that the radiator can heat the chip through the chip preheating unit, and multifunction is achieved; the problem of extremely unstable low-temperature starting performance of the existing chip is effectively solved; and in addition, the radiator is quiet simple in structure, low in production and processing difficulty, and capable of promoting batch production and upgrading of the existing radiator.

Description

technical field [0001] The invention belongs to the technical field of heat sinks, in particular to a heat sink with a chip heating function. Background technique [0002] At present, existing heat sinks on the market only have a heat dissipation function, and their functions are very single. However, the chips on the internal circuit board of electrical equipment are usually started at low temperature in a low temperature environment (such as in the north in winter), and the working performance is extremely unstable, which is likely to cause errors in the system operation, resulting in the failure of the electrical equipment to operate normally. Contents of the invention [0003] In order to solve the above-mentioned technical problems in the prior art, the present invention provides a chip heating function, which effectively solves the problem of extremely unstable low-temperature start-up performance of the existing chip, and has a simple structure and low difficulty in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34
CPCH01L23/345
Inventor 班宇何涛
Owner ZHUHAI JGALAXY THERMAL TECH CO LTD
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