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2N-1-path band-shaped power amplifier

A power divider and strip-shaped technology, applied in the field of microwave components, can solve the problems of increased volume and weight, and achieve the effects of simple structure, obvious engineering application effect, and strong confidentiality

Inactive Publication Date: 2017-03-22
SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If a multi-level power divider is used, one of the output ports needs to be terminated with an RF load at the last level, which will increase the volume and weight

Method used

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  • 2N-1-path band-shaped power amplifier
  • 2N-1-path band-shaped power amplifier

Examples

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Embodiment

[0016] refer to figure 2 The printed board 5 of the present invention is formed by lamination of the top layer 51, the middle layer 52 and the bottom layer 53. There is a substrate medium 511 between the top layer 51 and the middle layer 52, and there is a prepreg layer 531 between the bottom layer 53 and the middle layer 52. The power splitter main body 2 is disposed on the middle layer 52 of the printed board 5 by corroding the printed circuit board; wherein, the top layer 51 and the bottom layer 53 are PCB copper clad boards. In order to reduce the insertion loss of the power divider, the printed board substrate layer and the prepreg layer use high-performance microwave PCB materials with low dielectric loss.

[0017] The printed board substrate medium 511 is a microwave board with excellent performance, and meets the requirement of having a buried resistance layer or adding a buried resistance layer.

[0018] The printed board prepreg layer 531 is a material with excelle...

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PUM

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Abstract

The invention discloses a 2N-1-path band-shaped power amplifier which comprises a printed board and a power amplifier main body. The printed board is formed by laminating a top layer, a middle layer and a bottom layer, a base material medium is arranged between the top layer and the middle layer of the printed board, a semi-cured layer slice layer is arranged between the bottom layer and the middle layer, and the power amplifier main body is arranged on the middle layer of the printed board in a mode of corroding a printed board circuit, wherein the power amplifier main body is a band-shaped line and is provided with an input port, output ports and a terminating port; the same type of N stages of one- to-two multistage cascaded band-shaped power amplification structures are arranged between the input port and the output ports; one output port in a tail-stage band-shaped power amplification structure is the terminating port; and the terminating port is grounded. The 2N-1-path band-shaped power amplifier disclosed by the invention not only can meet the integrated design requirement in the microwave multilayer printed board, but also has the advantages of high confidentiality, reliable structure, obvious engineering application effect and the like, and can be applied to an antenna array feeding network in a radio frequency microwave system and other functional circuit modules.

Description

technical field [0001] The invention relates to the technical field of microwave components, and is a power divider structure; in particular, a 2-way power divider for realizing integration with a microwave PCB printed board N -1 way ribbon splitter. Background technique [0002] The power divider is a key component of the microwave feeding network. The traditional power distribution devices currently used in the market have disadvantages such as large volume, heavy weight, difficult installation, and difficulty in integration, and it is difficult to meet the technical development requirements of miniaturization, integration, and modularization of RF and microwave systems. [0003] for 2 N -1 (N≥2) microstrip / ribbon power divider structure, generally implemented by multi-stage 1-2 unequal power divider. However, this structure requires accurate power distribution calculations, especially for the design of equal-power broadband power splitters with N≥4, which is technicall...

Claims

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Application Information

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IPC IPC(8): H01P5/16
CPCH01P5/16
Inventor 邵建兴杨帆
Owner SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST