2N-1-path band-shaped power amplifier
A power divider and strip-shaped technology, applied in the field of microwave components, can solve the problems of increased volume and weight, and achieve the effects of simple structure, obvious engineering application effect, and strong confidentiality
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[0016] refer to figure 2 The printed board 5 of the present invention is formed by lamination of the top layer 51, the middle layer 52 and the bottom layer 53. There is a substrate medium 511 between the top layer 51 and the middle layer 52, and there is a prepreg layer 531 between the bottom layer 53 and the middle layer 52. The power splitter main body 2 is disposed on the middle layer 52 of the printed board 5 by corroding the printed circuit board; wherein, the top layer 51 and the bottom layer 53 are PCB copper clad boards. In order to reduce the insertion loss of the power divider, the printed board substrate layer and the prepreg layer use high-performance microwave PCB materials with low dielectric loss.
[0017] The printed board substrate medium 511 is a microwave board with excellent performance, and meets the requirement of having a buried resistance layer or adding a buried resistance layer.
[0018] The printed board prepreg layer 531 is a material with excelle...
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