Polyphenyl insulation board

A thermal insulation board and polystyrene technology, applied in the direction of thermal insulation, building components, etc., can solve the problems of poor crack resistance, poor thermal insulation performance of thermal insulation boards, poor compressive performance, etc., and achieve high compressive strength and superior water resistance , Excellent thermal insulation performance

Inactive Publication Date: 2017-04-05
TAIZHOU DONGSHENG STEEL STRUCTURE ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing thermal insulation boards have poor thermal insulation performance, poor compressive performance, poor crack resistance and many other problems

Method used

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  • Polyphenyl insulation board
  • Polyphenyl insulation board

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Embodiment Construction

[0013] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments.

[0014] Such as figure 1 , figure 2 As shown, a polystyrene insulation board includes a board body 1; the board body 1 is provided with an upper cover plate 5, and the upper cover plate is provided with a reinforcing unit 4; The base plates 2 are connected; the upper cover plate 5 is provided with an insulating layer 6, the insulating layer 6 is provided with a reinforcing layer 7, and the reinforcing layer 7 is provided with an anti-crack layer 8; the insulating layer 7 is made of polystyrene , cement and superglue; the reinforcing layer 8 is made of reinforcing fiber and superglue; the anti-cracking layer 8 is made of anti-cracking agent; the thickness ratio of the upper cover plate 5 and the base plate 2 is 5: 1.

[0015] The invention has many advantages such as excellent thermal insulation performance, extremely high compressive strength, good c...

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PUM

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Abstract

The invention discloses a polyphenyl insulation board which comprises a board body (1). An upper cover plate (5) is arranged on the board body (1). A reinforcing unit (4) is arranged on the upper cover plate. The upper cover plate (5) is connected with a base layer plate (2) through supporting triangular plates (3). A heat insulation layer (6) is arranged on the upper cover plate (5). A reinforcing layer (7) is arranged on the heat insulation layer (6). An anti-cracking layer (8) is arranged on the reinforcing layer (7).

Description

technical field [0001] The invention discloses a thermal insulation board, in particular to a polystyrene thermal insulation board. Background technique [0002] Polystyrene insulation board is widely used in wall insulation, flat concrete roof and steel structure roof insulation, low-temperature storage ground, airport runway, highway and other moisture-proof insulation. The existing thermal insulation board has many problems such as poor thermal insulation performance, poor compressive performance, poor crack resistance performance and the like. Contents of the invention [0003] The technical problem to be solved by the invention is to provide a polystyrene insulation board with excellent thermal insulation performance, extremely high compressive strength and good crack resistance. [0004] In order to solve the above technical problems, the present invention provides a polystyrene insulation board, including a board body; the board body is provided with an upper cover...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80
Inventor 李秀琴
Owner TAIZHOU DONGSHENG STEEL STRUCTURE ENG
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