Thermal interface materials including electrically-coductive material

Abstract

The invention relates to thermal interface materials including an electrically-conductive material. According to various aspects, exemplary embodiments are disclosed of thermal interface materials including an electrically-conductive material, shields including thermal interface materials, and related methods.

Description

technical field [0001] The present disclosure generally relates to thermal interface materials that include electrically conductive materials. Background technique [0002] This section provides background information related to the present disclosure which is not necessarily prior art. [0003] Electronic components (such as semiconductors, integrated circuit components, transistors, etc.) typically have a pre-designed temperature at which they operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. However, the operation of electronic components generates heat. If the heat is not removed, electronic components may operate at temperatures significantly higher than their normal or expected operating temperature. Such excessive temperatures can adversely affect the operating characteristics of electronic components and the operation of associated equipment. [0004] In order to avoid or at least reduce the adverse opera...

AI Technical Summary

Problems solved by technology

[0005] In addition, a common problem with the operation of electronic equipment is the generation of electromagnetic radiation within the electronic circuits of the equipment

This radiation may cause electromagnetic interference (EMI) or radio frequency interference (RFI), which may interfere with the operation of other electronic equipment within a distance

Without adequate shielding, EMI / RFI interference can cause attenuation or complete loss of important signals, rendering electronic equipment inefficient or inoperable

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