Organic secondary encapsulation slurry for sheet-type resistors, and preparation method thereof

Abstract

The invention relates to an organic secondary encapsulation slurry for sheet-type resistors, and a preparation method thereof, wherein the organic secondary encapsulation slurry at least contains, by weight, 10-30% of a black pigment, 30-50% of an oxide, 5-10% of an organic resin, and 30-50% of an organic resin, and mixing stirring and rolling with a three-roller grinder are performed to obtain the product. According to the present invention, the organic encapsulation slurry has advantages of good adhesion, good chemical stability, good stability, room temperature storage, and strong competitiveness and broad market prospects in the sheet-type resistor industry.

Description

Technical field [0001] The invention belongs to electronic paste and a preparation method, and particularly relates to a secondary encapsulation paste for chip resistors and a preparation method. Background technique [0002] Electronic paste is one of the basic materials of electronic components and the core component of electronic components, which plays a decisive role in the performance of electronic products. Chip resistors are one of the industries that have developed very rapidly since the 21st century. , Due to its light, small and thin characteristics, leading the development of electronic products to the trend of miniaturization, precision and intelligence. [0003] The composition of chip resistors is as figure 1 As shown in the figure, it can be seen that the encapsulation layer protects the core functional layer of the chip resistor-the resistor layer. Therefore, the performance of the product plays a key role in the stability of the chip resistor components. The ea...

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Problems solved by technology

[0006] (1) This product belongs to organic slurry, and its solvent and resin are used at low temperature. Therefore, the product needs to be stored at low temperature. The general storage temperature is -10°C to 0°C, and the aging time at room temperature is low. Therefore, the present invention is aimed at storage temperature for research;

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