Copper-aluminum connecting piece face-face penetrating fusion welding technique and preparation method
A connector, copper-aluminum technology, which is applied in the surface-surface infiltration and welding process and preparation field of copper-aluminum connectors, can solve the problem of coarse grains of substrates, affecting the physical properties, mechanical properties and electrochemical and chemical indicators of substrates and bonding surfaces, The copper-aluminum joint surface cannot form a continuous and firm joint surface, etc., so as to achieve the effect of high mechanical strength and high density
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0029] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings.
[0030] In this embodiment, a copper-aluminum connector surface-surface infiltration welding process is used. On the joint surface of the lead-aluminum connector, its main microstructure is a solid solution structure formed during the physical preparation process, which is provided by low-temperature friction and ultra-high pressure. Energy, so that the solid-phase aluminum and solid-phase copper atoms or molecules deviate from the equilibrium position for long-distance migration, thereby forming a solid-phase connection surface with physical connection properties. The result is that the total amount of solid solution in the bonding surface is > 95% or the total amount of compound + oxide + mixture in the firmly bonding surface is ≤ 5%.
[0031] The ultra-high pressure applied to the joint surface of th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com