Manufacturing method for metal-based copper clad laminate

Abstract

The invention discloses a manufacturing method for a metal-based copper clad laminate. The manufacturing method includes the steps that 1, a metal substrate and a copper clad are provided, and a resin composition of an insulating layer is prepared; 2, with Al2O3 or AlN or BeO or SiC dry powder being a raw material, thermal spraying is carried out on the surface of the metal substrate at ultrahigh temperature through thermal spraying equipment; 3, the resin composition is ground, and then the rough surface of the copper clad is coated with the resin composition through a coating machine to be baked; 4, the copper clad, coated with resin, of the semi-solidified state resin layer and the metal substrate after thermal spraying treatment are put between two mirror surface steel plates to be overlapped and put in a hot press to be subjected to vacuum pressing. According to the method, by carrying out thermal spraying treatment on the surface of the metal substrate, the bonding force with the copper clad coated with the resin is improved, the thickness of the insulating layer can be reduced on the premise of not lowering pressure-resistant capacity, and therefore the heat-conduction, heat-dissipation and pressure-resistant properties of the metal-based copper clad laminate can be improved.

Description

technical field [0001] The invention relates to the field of copper-clad laminates for printed circuits, in particular to a method for manufacturing metal-based copper-clad laminates. Background technique [0002] Traditional metal-based copper-clad laminates can be prepared by the following method: the resin thermally conductive filler composition in the insulating layer formula is ground and then coated on the rough surface of the copper foil or the surface of the metal base by a coating machine, and baked in an oven , to obtain the resin-coated copper foil of the resin layer in the semi-cured state, and then laminate the metal substrate, the resin-coated copper foil of the resin layer in the semi-cured state, and the mirror steel plate, and place them in a hot press for high temperature and high pressure according to the set procedure to insulate The layer is solidified, so that the metal substrate and the copper foil are combined to obtain a metal-based copper-clad lamin...

AI Technical Summary

Problems solved by technology

If the traditional metal substrate needs to achieve the breakdown voltage of the insulating layer ≥ 3.0KV, its thickness must be at least 100 μm, but at the same time, the problem is that the thermal resistance of the insulating layer will increase, which will affect the heat dissipation effect of the metal substrate