Silicon wafer splicing material box and automatic feeding device thereof

Abstract

The invention discloses a silicon wafer splicing material box and an automatic feeding device thereof. The splicing material box mainly comprises a U-shaped material box body, a bottom sliding groove, a bottom buckle groove, a top sliding groove, a top buckle, a bottom supporting plate and a containing groove. The automatic feeding device mainly comprises the splicing material box used for containing silicon wafers, a supporting platform, a connecting support, a lifting sliding block, a transmission assembly, a drive motor and a sensor set used for detecting the positions of the silicon wafers and the splicing material box. The four to six material boxes can be simultaneously loaded in the automatic feeding device at a time, a conveying device continuously conveys the multiple stacked material boxes loaded at a time while pausing or additional operation is not needed in the material box descending switching process, the silicon wafer feeding efficiency is greatly improved, and the needed labor cost is greatly reduced. Through rapid splicing of the designed silicon wafer tool material boxes, high efficiency and low cost of automatic silicon wafer feeding are achieved. According to the silicon wafer splicing material box and the automatic feeding device thereof, design is simple and feasible, the production cost is low, feeding workers can conduct operation conveniently, and safety is high.

Description

technical field [0001] The invention relates to the field of production and manufacture of solar photovoltaic modules, in particular to an assembly magazine for automatic feeding of silicon wafers and a feeding device thereof. Background technique [0002] In the field of solar photovoltaic module production, silicon rods are cut into pieces of silicon wafers after being cut by a slicer, and silicon wafers need to be sorted on a sorting machine to screen out qualified products, defective products and scrapped products. [0003] At present, more than 90% of domestic silicon wafer sorting equipment adopts the German WIS type HenneAke sorting system, which has high stability and measurement accuracy, but low efficiency in the feeding stage. On the one hand, the current conventional method of transporting silicon wafers to the conveyor belt is to arrange multiple silicon wafers in advance and place them in the magazine, and control the contact of the silicon wafers with the hori...

AI Technical Summary

Problems solved by technology

[0003] At present, more than 90% of the domestic silicon wafer sorting equipment adopts the German WIS type HenneAke sorting system, which has high stability and measurement accuracy, but the efficiency of the feeding stage is low

On the one hand, the current conventional method of transporting silicon wafers to the conveyor belt is to arrange multiple silicon wafers in advance and place them in the magazine, and control the contact of the silicon wafers with the horizontal conveyor belt one by one by controlling the height of the magazine. input, after feeding the material box, it is necessary to take down the material box and then load the film before use, which requires workers to frequently load the film and replace the material box frequently, resulting in low feeding efficiency and increased labor costs; on the other hand, there are The equipment uses two manipulators to load one material box at a time, and switch back and forth in the horizontal direction to move the loading device to the loading platform for silicon wafer transfer. This will take a long time to switch the manipulators, resulting in workers needing more time. High frequency loading material boxes, at least every two sorting systems need to arrange a material loading operator, high labor cost

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