A Shock Wave Excitation Device That Can Excite Mems Microstructures in a Vacuum Environment

Abstract

The invention discloses a shock wave excitation device capable of exciting MEMS microstructures in a vacuum environment. The needle electrode unit pointing to the microstructure unit is provided on the board; the microstructure unit includes a mounting sleeve, and an elastic base is pressed at one end of the mounting hole of the mounting sleeve, and the elastic base is in the shape of a circular sheet with a The ring-shaped boss is equipped with a plate electrode through an insulating sleeve in the elastic base, and a MEMS microstructure is installed on the inner side of the elastic base; an optical glass plate is pressed into the other end of the installation hole; a vacuum joint is arranged radially on the outer wall of the installation sleeve ; The needle electrode and the plate electrode are respectively electrically connected to the two poles of the high-voltage capacitor, and the two poles of the high-voltage capacitor are respectively electrically connected to the positive and negative poles of the high-voltage power supply. The structure of the device is firmly installed, the operation is simple and safe, and it is convenient to test the dynamic characteristic parameters of the microstructure in a vacuum environment.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a shock wave excitation device capable of exciting MEMS microstructures in a vacuum environment. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it ...

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Problems solved by technology

However, the device still has the following disadvantages: first, a cross spring is used in the device as a base structure for carrying microstructures, and the microstructure and its installation structure are bonded to the top center of the cross spring. When the structure is excited, the cross spring will produce a large bending deformation; on the one hand, this will cause the deformation of the microstructure mounting plate, resulting in damage to the microstructure; on the other hand, this will make the gap between the microstructure mounting plate and the cross spring The cured glue between them bears a lot of tension. After multiple excitations, the glue is easy to crack, and the microstructure mounting plate will loosen and break away from the cross spring piece; secondly, in the device, the cross spring piece, ceramic piece and plate The electrodes are stacked up and down, and are fixed by glue bonding between two adjacent parts. This bonding structure is not strong enough. After multiple discharges, the layers are easy to separate from each other; Third, in the device, the feeding mechanism can only be adjusted manually, and cannot realize automatic feeding, resulting in cumbersome discharge operation and poor safety; fourth, since the microstructure is completely exposed to the air, when it is necessary to test the microstructure in a vacuum environment When the dynamic characteristics are lower, the device cannot meet the demand because it cannot be discharged in a vacuum environment.

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