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Laser packaging system and method for temperature control in laser packaging process

A technology of laser packaging and temperature control, which is applied in laser welding equipment, manufacturing tools, semiconductor/solid-state device manufacturing, etc., can solve the problems of increasing system cost, complex system design and integration, and increasing system cost, so as to reduce complexity, The effect of ensuring the service life and sealing performance and reducing costs

Inactive Publication Date: 2017-05-03
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this solution increases the cost of the system due to the increased integration of pyrometers
At the same time, a scheme is disclosed in document CN101842918, which enables the shape, size and intensity distribution of the laser spot to be changed at the corner by a variable laser beam. It is circular, etc., to achieve the purpose of glass frit temperature consistency, but the beam shaper in this scheme is required to be able to change the characteristics of the laser beam in real time (such as the shape and intensity distribution of the laser beam), so several lenses are added, which not only improves the The cost of the system also complicates the design and integration of the system

Method used

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  • Laser packaging system and method for temperature control in laser packaging process
  • Laser packaging system and method for temperature control in laser packaging process
  • Laser packaging system and method for temperature control in laser packaging process

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Embodiment 1

[0057] Such as Figure 10 , 11 As shown, the first laser packaging system implementing the method of the present invention includes:

[0058] The glass substrate 100 to be packaged that has been arranged with a glass frit pattern and pre-sintered;

[0059] The workpiece table 40 is used to support the glass substrate 100 to be packaged. During the laser packaging process, the workpiece table 40 is fixed;

[0060] The laser 10 that can adjust the power in real time provides a laser beam 101, an optional semiconductor laser, and the wavelength is in the infrared band (800nm~1000nm);

[0061] The scanning galvanometer unit 20 receives the laser beam 101 emitted by the laser 10, and after internal reflection and focusing, projects the laser beam 201 onto the glass frit pattern of the glass substrate 100, such as Figure 11 The scanning galvanometer unit 20 shown includes two rotatable mirrors 2001, 2002 driven by a motor (not shown) and an F-Theta lens (not shown) for controlli...

Embodiment 2

[0064] Such as Figure 12 , 13 As shown, the difference from Embodiment 1 is that the scanning galvanometer unit 20 in the laser packaging system of this embodiment does not rotate the beam, but only reflects the focused laser beam 101, that is to say, the laser beam 201 is projected to the focused spot position at the glass frit pattern. Fixed; the scanning control card 30 is connected to the workpiece table 40 through the signal line 303, and the motion parameters of the workpiece table 40 (including the maximum moving displacement, acceleration, speed and moving position target of the motion table) are set to control the motion of the workpiece table 40. The motion trajectory is consistent with the glass powder pattern. During the motion, the scanning control card 30 detects the X-direction and Y-direction movement speed of the motion table, and calculates the composite speed of the rounded section of the workpiece table motion trajectory according to the kinematics princip...

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Abstract

The invention provides a laser packaging system and a method for temperature control in the laser packaging process. The system comprises a glass substrate, a laser, a scanning galvanometer, a workpiece table and a control module; a glass powder pattern for sealing the glass substrate is arranged on the glass substrate; the laser is used for providing a laser beam; the scanning galvanometer controls motion of the laser beam and projects the laser beam to the glass powder pattern; the workpiece table is used for supporting the glass substrate; and the control module is used for detecting the motion velocity of the laser beam relative to the glass substrate and controlling the laser according to the motion velocity to change the power of the laser beam, so that the temperature of light spots projected to various positions of the glass powder pattern is uniform. Compared with the prior art, the system and the method have the advantages as follows: pyrometers in existing technical schemes are omitted, so that the laser packaging cost is reduced; and the shape, the size or the light intensity distribution of laser beams in existing systems is not required to be changed, therefore, the complexity of the system is reduced.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a laser packaging system and a temperature control method in the laser packaging process. Background technique [0002] Since the 21st century, organic light-emitting diodes (Organic Light-Emitting Diode, OLED) have become a leading technology in the field of flat panel display and lighting due to their excellent characteristics such as self-illumination, wide viewing angle, low power consumption, ultra-thin and flexible display. important direction of development. However, because the organic light-emitting materials and electrodes used in OLED displays are extremely sensitive to water vapor and oxygen in the surrounding environment, they will deteriorate due to interaction and cause dark spots, which seriously affect their lifespan. If a certain technology can be used to encapsulate the entire light-emitting device to isolate oxygen and moisture from t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K26/70H01L51/52
CPCB23K26/206H10K50/84
Inventor 贾俊伟徐文王帆
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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