Composite sintering aid for producing aluminum nitride ceramic substrate

Abstract

The invention relates to a composite sintering aid for producing an aluminum nitride ceramic substrate. The composite sintering aid is prepared from an alkali metal compound, an alkaline-earth metal compound and a rare-earth metal compound, and the molar ratio of the alkali metal compound to the alkaline-earth metal compound to the rare-earth metal compound is equal to 250 to (80-86) to 1000, wherein the alkali metal compound is Li2O, the alkaline-earth metal compound is a mixture of MgO and CaO, and the rare-earth metal compound is YF3. The composite sintering aid has the advantages that the YF3 is selected to be used as the rare-earth metal compound, and the mixture of the MgO and the CaO is selected to be used as the alkaline-earth metal compound, so that the composite sintering aid can greatly improve the heat conduction efficiency, and further promotes the densification of aluminum nitride ceramics.

Description

technical field

[0001] The invention relates to a sintering aid, in particular to a sintering aid for producing aluminum nitride ceramic substrates

[0002] Composite sintering aid. Background technique

[0003] With the development of modern science and technology, the requirements for materials are increasing day by day. With the increasing complexity and density of components in electronic devices and electronic devices, higher requirements are put forward for ceramic substrates, which are important pillars of integrated circuits. Has good thermal conductivity. For a long time, the substrate material of most high-power hybrid integrated circuits has been using Al 2 o 3 and BeO ceramics. But Al 2 o 3 The thermal conductivity of ceramics is low, and the thermal expansion coefficient does not match Si; although BeO ceramics have excellent comprehensive properties, their high production costs and high toxicity seriously restrict their application and promotion. Therefo...

Examples

Embodiment 1

[0016] A composite sintering aid for producing aluminum nitride ceramic substrates, the composite sintering aid is composed of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds, and the moles of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds The ratio is 250:80-86:1000; wherein, the alkali metal compound is Li 2 O, the alkaline earth metal compound is a mixture of MgO and CaO, and the molar ratio of MgO and CaO is 1:1.06; the rare earth metal compound is YF 3 . The sintering temperature is 1380°C, and the holding time is 3 hours. The conductivity of the obtained aluminum nitride ceramic substrate is 180W / m·k, and the bulk density is 3.28g / cm 3 .

Embodiment 2

[0018] A composite sintering aid for producing aluminum nitride ceramic substrates, the composite sintering aid is composed of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds, and the moles of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds The ratio is 250:80-86:1000; wherein, the alkali metal compound is Li 2 O, the alkaline earth metal compound is a mixture of MgO and CaO, and the molar ratio of MgO and CaO is 1:1.06; the rare earth metal compound is YF 3 . The sintering temperature is 1420°C, and the holding time is 3 hours. The conductivity of the obtained aluminum nitride ceramic substrate is 183W / m·k, and the bulk density is 3.31g / cm 3 .

technical field

[0001] The invention relates to a sintering aid, in particular to a sintering aid for producing aluminum nitride ceramic substrates

[0002] Composite sintering aid. Background technique

[0003] With the development of modern science and technology, the requirements for materials are increasing day by day. With the increasing complexity and density of components in electronic devices and electronic devices, higher requirements are put forward for ceramic substrates, which are important pillars of integrated circuits. Has good thermal conductivity. For a long time, the substrate material of most high-power hybrid integrated circuits has been using Al 2 o 3 and BeO ceramics. But Al 2 o 3 The thermal conductivity of ceramics is low, and the thermal expansion coefficient does not match Si; although BeO ceramics have excellent comprehensive properties, their high production costs and high toxicity seriously restrict their application and promotion. Therefo...

Examples

Embodiment 1

[0016] A composite sintering aid for producing aluminum nitride ceramic substrates, the composite sintering aid is composed of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds, and the moles of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds The ratio is 250:80-86:1000; wherein, the alkali metal compound is Li 2 O, the alkaline earth metal compound is a mixture of MgO and CaO, and the molar ratio of MgO and CaO is 1:1.06; the rare earth metal compound is YF 3 . The sintering temperature is 1380°C, and the holding time is 3 hours. The conductivity of the obtained aluminum nitride ceramic substrate is 180W / m·k, and the bulk density is 3.28g / cm 3 .

Embodiment 2

[0018] A composite sintering aid for producing aluminum nitride ceramic substrates, the composite sintering aid is composed of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds, and the moles of alkali metal compounds, alkaline earth metal compounds and rare earth metal compounds The ratio is 250:80-86:1000; wherein, the alkali metal compound is Li 2 O, the alkaline earth metal compound is a mixture of MgO and CaO, and the molar ratio of MgO and CaO is 1:1.06; the rare earth metal compound is YF 3 . The sintering temperature is 1420°C, and the holding time is 3 hours. The conductivity of the obtained aluminum nitride ceramic substrate is 183W / m·k, and the bulk density is 3.31g / cm 3 .