Molecular marker DNdCAPS8.03-1 chained with corn head smut-resistant secondary and primary loci and application thereof

A head smut resistance and molecular marker technology, applied in the field of genetic engineering, can solve the problems of lack of main effect and single disease resistance gene, etc., and achieve the effect of accelerating the process of screening disease-resistant varieties.

Active Publication Date: 2017-05-10
NORTHEAST AGRICULTURAL UNIVERSITY
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, due to the lack of a single main-effect disease resistance gene in maize, maize breeders can only use the disease to accumulate multiple disease resistance QTLs to achieve a higher level of resistance.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Molecular marker DNdCAPS8.03-1 chained with corn head smut-resistant secondary and primary loci and application thereof
  • Molecular marker DNdCAPS8.03-1 chained with corn head smut-resistant secondary and primary loci and application thereof
  • Molecular marker DNdCAPS8.03-1 chained with corn head smut-resistant secondary and primary loci and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Example 1 The establishment of the SNP site linked to the sub-major locus of resistance to head smut in maize and the molecular marker DNdCAPS8.03-1 based on this site

[0035] 1. Bioinformatics analysis of the candidate gene GRMZM2G047152 located in bin8.03 sub-main disease resistance region of maize

[0036] 1 Materials and methods

[0037] The research object of this experiment is the candidate gene GRMZM2G047152 located in bin8.03 region, which is a disease resistance gene containing NBS structure.

[0038] The gene GRMZM2G047152 was retrieved on the MaizeGDB and Phytozome11 websites, and the gene structure analysis of the nucleotide sequence was carried out by using the online prediction gene software Fgenesh.

[0039] The amino acid sequence of the candidate gene GRMZM2G047152 was predicted and its conserved domains were analyzed using ORF Finder and CD-search in NCBI.

[0040] Log in to the NCBI website and use the BLAST tool on the website to perform homology ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a molecular marker DNdCAPS8.03-1 chained with corn head smut-resistant secondary and primary loci and application thereof, and belongs to the technical field of gene engineering. The invention further relates to an SNP (Single Nucleotide Polymorphism) locus chained with the corn head smut-resistant secondary and primary loci. The SNP locus is positioned at the 3169th site in a resistance gene candidate GRMZM2G047152 open reading frame in a corn genome bin8.03 area; when the locus is G, disease resistance is shown; when the locus is A, disease infection is shown. A dCAPS marker is developed based on an SNP marker, and is named as DNdCAPS8.03-1; an incision enzyme of the molecular marker is BsiHKAI; a restriction enzyme cutting site is GWGCWC; a PCR amplification product is 137bp; a product after enzyme digestion is 114bp. When the DNdCAPS8.03-1 is used in combination with molecular markers MZA6393 and LSdCAP2 which are positioned in a bin2.09 primary disease-resistant locus area, the selection efficiency is greatly higher than that of a single marker. Thus, the molecular marker NdCAPS8.03-1 can be applied to corn head smut-resistant molecular marker-assisted breeding, so that the selection process of screened disease-resistant varieties of corn head smut-resistant germplasm resources is accelerated.

Description

technical field [0001] The present invention relates to a SNP locus and molecular markers developed based on it and its application, in particular to a SNP locus linked with a maize anti-head smut sub-primary anti-disease locus, and a molecular marker based on the locus and its application in molecular marker-assisted breeding for resistance to head smut in maize. It belongs to the technical field of genetic engineering. Background technique [0002] Corn head smut is a worldwide disease. In recent years, the planting area of ​​corn has increased year by year, and the phenomenon of continuous cropping has become serious. The occurrence of head smut has also increased year by year. In general, the incidence of the disease is 5% to 10%, and it is more than 60% in individual plots. For every 1% increase in the rate of susceptible plants, the corn yield will be reduced by 100kg / hm 2 , seriously affecting the improvement of corn yield. The use of chemical drugs to prevent and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C12Q1/68C12N15/11
CPCC12Q1/6895C12Q2600/13C12Q2600/156
Inventor 王振华邸宏张林张晓明周璇
Owner NORTHEAST AGRICULTURAL UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap