Surface treatment method for CPU cover
A technology of surface treatment and sintering treatment, which is applied in the direction of coating, metal material coating process, manufacturing tools, etc., can solve the problem of insufficient boiling performance of the CPU cover, and achieve the effects of lowering temperature, strengthening boiling performance and efficient heat dissipation
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Embodiment 1
[0027] Remove the rust and grease on the surface of the copper sheet, and then apply a layer of binder solution, and evenly stick the silver powder on the surface of the copper sheet. When the binder solution is air-dried, place it in a sintering furnace. Heating under the protection of hydrogen until the surface of the silver powder tends to melt, and then keep the temperature for 15 minutes to disperse and volatilize the binder, and the silver powder is sintered into one and sintered on the surface of the copper sheet, thereby forming a layer of porous metal overlay. Wherein, the thickness of the porous metal covering layer is less than 3mm, and the porosity is 40%-65%. The copper sheet is welded on the CPU cover.
Embodiment 2
[0029] Remove the rust and grease on the surface of the silver sheet, and then apply a layer of binder solution, and evenly stick the copper powder on the surface of the silver sheet. When the binder solution is air-dried, place it in a sintering furnace. Heating under the protection of hydrogen until the surface of the copper powder tends to melt, and then keep the temperature for 20 minutes to disperse and volatilize the binder, and the copper powder is sintered into one and sintered on the surface of the silver sheet, thereby forming a layer of porous metal overlay. Wherein, the thickness of the porous metal covering layer is less than 3mm, and the porosity is 40%-65%. The silver sheet is welded on the CPU cover.
Embodiment 3
[0031] Remove the rust and grease on the surface of the gold sheet, and then apply a layer of binder solution, and evenly stick the copper powder on the surface of the gold sheet. After the binder solution is air-dried, place it in a sintering furnace. Heating under the protection of hydrogen until the surface of the copper powder tends to melt, and then keep the temperature for 18 minutes to disperse and volatilize the binder, and the copper powder is sintered into one and sintered on the surface of the gold sheet, thereby forming an layer of porous metal overlay. Wherein, the thickness of the porous metal covering layer is less than 3mm, and the porosity is 40%-65%, and the gold sheet is welded on the CPU cover.
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