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Optical module

A technology of optical modules and optical sub-modules, applied in the field of optical modules, can solve problems such as EMC performance that cannot meet the specified requirements, electromagnetic compatibility) performance defects, etc., to achieve the effect of reducing electromagnetic radiation and improving EMC performance

Active Publication Date: 2017-05-10
HISENSE BROADBAND MULTIMEDIA TECH
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  • Abstract
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Problems solved by technology

[0005] see Figure 4 , since the high-speed transmission lines 223a and 225a are in the form of microstrip lines, such microstrip lines will generate relatively large outward electromagnetic radiation when carrying high frequency, large voltage swing, and large current swing, and this electromagnetic radiation will pass through The port of the optical module 10a radiates out, causing certain defects in the EMC (Electro Magnetic Compatibility, electromagnetic compatibility) performance of the optical module 10a, which in turn will cause the EMC performance of the device equipped with the optical module 10a to fail to meet the specified requirements

Method used

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Embodiment Construction

[0024] The present invention will be further elaborated below in conjunction with the accompanying drawings.

[0025] see Figure 5 , Figure 5 It is a structural representation of an embodiment of the optical module of the present invention. The present invention proposes an optical module 10, which includes: a circuit board 2, a gold finger 4 arranged at one end of the circuit board 2, and an optical chip arranged on the circuit board 2 in the form of COB (Chip On Board, chip on board) 5. Encapsulation structure 6 and optical connector 7 . Such a structure of the optical module 10 is beneficial to the miniaturization and compactness of the optical module 10 by integrating the optical chip 5 and the circuit board 2 , and can increase the application range of the optical module 10 .

[0026] see Image 6 , Image 6 yes Figure 5 The working principle of the shielding cage of the circuit board in the optical module shown is schematic. The circuit board 2 is a multi-layer...

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Abstract

The invention discloses an optical module, and the optical module comprises a circuit board which is provided with a high-speed transmission line, wherein one end of the transmission line is connected with a drive chip. The circuit board is provided with two ground planes, which are vertically opposite to each other. The high-speed transmission line is clamped between the two ground planes. The circuit board is also provided with a plurality of metal via holes around the high-speed transmission line, and the metal via holes enable the two ground planes to be communicated, and form a shielding cage with the two ground planes, wherein the shielding cage enables the high-speed transmission line to be shielded. The optical module can greatly reduce the electromagnetic radiation emitted by the high-speed transmission line to the outside of the circuit board, and can effectively improve the EMC performance.

Description

technical field [0001] The invention relates to an optical module, in particular to a circuit board suitable for the optical module. Background technique [0002] see figure 1 , the optical module 10a includes a rigid circuit board 1a, a flexible circuit board 2a and an optical sub-module 3a. Among them, the flexible circuit board 2a is responsible for connecting the rigid circuit board 1a and the optical sub-module 3a. The optical sub-module 3a may be ROSA (Receiving Optical Sub-Assembly, light receiving assembly), TOSA (Transmitting Optical Sub-Assembly, light emitting assembly) or BOSA (Bi-Directional Optical Sub-Assembly, light transmitting and receiving assembly). The optical sub-module 3a includes an optical chip and a driver chip that cooperates with the optical chip, for example: the optical chip is a laser, and its driver chip is a device for providing signal processing for transmission; another example: the optical chip is a detector, and its driver chip A devic...

Claims

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Application Information

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IPC IPC(8): G02B6/42
CPCG02B6/4281
Inventor 赵伟于冬梅
Owner HISENSE BROADBAND MULTIMEDIA TECH
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