Electrical isolator packaging structure and manufacturing method for electrical isolator

Abstract

An electrical isolator packaging structure and a manufacturing method of an electrical isolator are provided. The electrical isolator packaging structure includes a first substrate, a second substrate, a coil, and a magnetic field (MF) sensor. The coil is disposed on the first substrate. The MF sensor is disposed on the second substrate. The position of the coil is arranged according to the position of the MF sensor such that the coil transmits a signal to the MF sensor. Thus, the electrical isolator can be implemented by magnetic coupling with the coil and the MF sensor.

Description

technical field [0001] The invention relates to a signal transmission technology, and in particular to an electrical isolator assembly structure and a manufacturing method of the electrical isolator. Background technique [0002] In the field of signal transmission, it is often necessary to transfer signals or energy from circuits in one voltage domain to circuits in another voltage domain, or to transfer signals or energy from one medium to another. However, due to the difference in voltage domain or medium type, the signal may interfere or break down the surrounding circuits through the parasitic path during the transmission process, resulting in damage. Therefore, for the sake of circuit reliability, electrical isolators, couplers or isolation barriers are usually used to transmit signals between circuits in different voltage domains to protect the circuits. [0003] Galvanic isolators can be used in many power circuit fields, such as power systems (such as power supplie...

AI Technical Summary

Problems solved by technology

If an optocoupler is used as an electrical isolator, since the process of light-emitting diodes (LEDs) is not compatible with the transistor process (for example, CMOS process), and the LED itself has issues such as light decay, heat loss, etc., it is impossible to integrate LEDs into In-chip but need additional packaging

If a transformer or capacitor that can be integrated into the chip is used as an electrical isolator, it may be necessary to transmit high-frequency signals to achieve effective transmission efficiency, resulting in the need to design additional modulation and demodulation functions for circuits using this type of electrical isolator , in order to successfully transmit the signal

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