Printed circuit board and manufacturing method thereof

Abstract

The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board comprises a board body, a first cover plate, a second cover plate and a heat conducting liquid. The board body is provided with at least one heat conducting slot in the thickness direction of the board body from a high temperature region to a low temperature region according to the high and low temperature distribution in operation of electronic devices, wherein the heat conducting slot extends in the plane where the board body is located, and the inner side wall of the heat conducting slot is provided with an isolation layer. The first cover plate and the second cover plate cover openings at two sides of the heat conducting slot in the thickness direction of the board body in a hermetical manner and are fixed on the board body to form a holding space with the heat conducting slot. The holding space is provided with a reflux device in the extension direction of the heat conducting hole and is filled with the heat conducting liquid. The first and second cover plate improve the strength of the heat conducting hole, so that the printed circuit board is prevented from warpage or break along the heat conducting slot. The holding space is internally provided with the reflux device and the heat conducting liquid, and the heat radiation efficiency of the printed circuit board is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of printed circuit boards, in particular to a printed circuit board and a manufacturing method thereof. Background technique [0002] Moore's Law was proposed by Gordon Moore, one of the founders of Intel (Intel). When the price remains constant, the number of components that can be accommodated on an integrated circuit decreases approximately every 18-24 months. It will be doubled, and the performance will be doubled. With the development of Moore's Law, the number of circuits integrated in the chip continues to increase; the advancement of electronic manufacturing technology also makes the number of circuits integrated on the printed circuit board per unit area continue to increase, and the heat dissipation of the printed circuit board has become a major factor in the improvement of the integration of electronic equipment. obstacle. With the development of thinner and lighter electronic product...

AI Technical Summary

Problems solved by technology

[0004] The existing heat dissipation methods have the following deficiencies: 1. The phase change material in the heat conduction slot cannot be fused with the printed circuit board material, resulting in a lower strength of the printed circuit board at the axis of the heat conduction slot, and it is easy to warp or break

2. The heat-conducting material needs to be processed into a shape corresponding to the heat-conducting slot hole with special equipment, which increases the process steps and requires special heat-conducting material forming equipment

3. There are strict restrictions on the material selection and milling groove shape of thermal conductive materials, resulting in limited application scenarios

4. The phase change material itself will undergo deformation and volume changes when it is heated and undergo phase change, causing the thermally conductive material to overflow the surface of the printed circuit board, reducing the reliability of the product

5. The heat conductor in the heat conduction slot cannot be fixed with the printed circuit board only through the adhesion of green oil. After the printed circuit board is formed, the green oil dries and the adhesion disappears. Extremely easy to detach from the printed circuit board

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