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Shared bootstrap capacitor for multiple phase buck converter circuit and methods

A technology of step-down converters and capacitors, applied in the direction of output power conversion devices, instruments, electronic switches, etc., which can solve unsatisfactory multi-phase DC-DC step-down converter board area, unsatisfactory, unavailable pins, etc. question

Active Publication Date: 2017-05-10
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The extra pins can undesirably increase the pin count of the converter integrated circuit and correspondingly increase packaging and other manufacturing costs
This can lead to situations where the required pins are not available at all
Furthermore, the use of multiple large external bootstrap capacitors undesirably increases the board area for implementing a multiphase DC-DC buck converter

Method used

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  • Shared bootstrap capacitor for multiple phase buck converter circuit and methods
  • Shared bootstrap capacitor for multiple phase buck converter circuit and methods
  • Shared bootstrap capacitor for multiple phase buck converter circuit and methods

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0026] Example embodiments provide a high efficiency multi-phase switching converter in a buck configuration, which is applicable to a variety of applications where a DC output voltage is provided from a DC input voltage. The figures are not necessarily drawn to scale.

[0027] figure 2 is a simplified circuit diagram of the high-side circuit portion 20 of the multi-phase buck converter of the example embodiment. exist figure 2 , the first switching stage 220 includes a high-side driver circuit 213 labeled "HSD_1" coupled to a gate terminal labeled "HSD_Gate_1" at the gate terminal of a high-side MOS switch 211 (which is an NMOS transistor). of nodes. The high-side MOS switch 211 has its source-to-drain current path coupled between the input voltage Vin and the switching node SW1.

[0028] In addition, in figure 2 , the second switching stage 240 includes a high-side driver circuit 233 labeled “HSD_2” coupled to a node labeled “HSD_Gate_2” which is the gate terminal of...

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Abstract

In described examples, a multiple phase dc to dc converter (20) with a shared bootstrap capacitor (221) includes n switching stages (220, 240), each coupled to a corresponding switching node (SW1, SW2), and each further including a high side driver MOS device (211, 231) coupled between a terminal for a positive voltage supply terminal (Vdd) and the corresponding switching node (SW1, SW2). An inductor (223, 243) is coupled in parallel between the corresponding switching node and an output terminal (Vo) configured for providing the DC output voltage. High side driver control circuitry (215) is configured to selectively couple a shared bootstrap capacitor (221) to a gate terminal of each of the high side drivers (211, 231). The shared bootstrap capacitor (221) is configured to charge a gate capacitance of each of the high side driver MOS devices (211, 231).

Description

technical field [0001] This generally relates to multi-phase switching circuits in DC-DC switching converters used to provide a reduced voltage from an input voltage. Background technique [0002] Recent improvements to DC power supply circuits have become increasingly important in portable and battery-powered devices. In such installations, the supply voltage is sometimes provided by an AC to DC transformer, or "brick," which outputs a DC voltage (eg, 12 volts or 24 volts) when AC power is available. Portable devices also typically operate on a similar DC voltage provided from a rechargeable battery or other battery when AC power is not available. Some portable devices may not have a "brick," but operate from batteries only. Electronic devices used in portable devices typically include integrated circuits such as microprocessors, volatile or non-volatile memory devices, digital radio or cell phone transceiver devices, and other functionalities such as Bluetooth, WiFi, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M3/158
CPCH02M1/084H02M3/1586H02M3/158H03K17/00
Inventor 杰雷·安德烈亚斯·米卡埃尔·耶尔维宁亚尔科·安特罗·罗塔玛
Owner TEXAS INSTR INC