Binding device, display panel, binding system and operation method thereof

A technology of display panel and operation method, applied in semiconductor/solid-state device parts, instruments, semiconductor/solid-state device testing/measurement, etc., can solve the problem of poor contact between the drive circuit and the electrical signal of the display panel, and the inability to realize the display panel binding area Real-time monitoring, inaccurate binding alignment, etc., to improve product yield, optimize binding effect, and improve binding efficiency

Inactive Publication Date: 2017-05-24
FUZHOU BOE OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Usually, when performing the binding process, first use pressure-sensitive paper to judge the flatness of the binding indenter, and then confirm the binding of several samples. After confirming that there is no problem with the binding of the several samples, the The confirmation result is the benchmark for continuous binding operations. Therefore, real-time monitoring of the position of the binding

Method used

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  • Binding device, display panel, binding system and operation method thereof
  • Binding device, display panel, binding system and operation method thereof
  • Binding device, display panel, binding system and operation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0046] Example one

[0047] Figure 2a Shows a schematic side view of a binding device provided by this embodiment; Figure 2b Shows a schematic side view of another binding device provided by this embodiment; image 3 It shows a schematic side view of another binding device provided in this embodiment. It should be noted, Figure 2a , Figure 2b with image 3 Only a part of the related structure of the binding device is shown for clearer description.

[0048] For example, such as Figure 2a As shown, the binding device of this embodiment includes a binding indenter 20, a supporting platform 21, an optical transmitter 23, and an optical receiver 24. A first alignment hole 201 is provided in the binding indenter 20, a second alignment hole 211 is provided in the supporting platform 21 at a position corresponding to the first alignment hole 201, and the supporting platform 21 is close to the binding indenter 20 The surface of is the table top 212 supporting the platform. The light ...

Example Embodiment

[0060] Example two

[0061] Figure 4a Shows a schematic top view of the display panel provided by this embodiment; Figure 4b Shows a schematic cross-sectional side view of the alignment mark on the display panel provided by this embodiment; Figure 4c It shows a schematic top view of the alignment mark on the display panel provided by this embodiment. Figure 4a-4c Still only a part of the related structure of the display panel is shown for clearer description.

[0062] For example, such as Figure 4a As shown, the display panel of this embodiment includes a first substrate 26 and a second substrate 27. The second substrate 27 includes a display area and a binding area 271 located at the periphery of the display area. The binding area 271 is provided with an alignment mark 270. For example, multiple alignment marks 270 may be provided, and the multiple alignment marks 270 correspond to the first alignment hole 201 provided in the binding indenter 20 and the second alignment hole ...

Example Embodiment

[0070] Example three

[0071] Figure 5a Shows a schematic side view of the binding system provided in this embodiment; Figure 5b for Figure 5a An enlarged schematic diagram of the middle R1 area. Figure 5a-5b Only a part of the related structure of the binding system is still shown for clearer description.

[0072] For example, such as Figure 5a As shown, the binding system provided in this embodiment includes the binding device described in the first embodiment and the display panel described in the second embodiment. The table top 212 of the supporting platform 21 in the binding device is used to carry the display panel. The light transmitter 23 emits the alignment light 250, and the alignment light 250 can sequentially pass through the first alignment hole 201, the alignment mark 270 and the second alignment hole 211, and finally is received by the light receiver 24. The binding system provided in this embodiment detects the spot size and shape of the alignment light 250 ...

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PUM

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Abstract

The invention provides a binding device, a display panel, a binding system and an operation method thereof. The binding system comprises the binding device and the display panel, wherein the binding device comprises a binding pressing head, a supporting platform, a light transmitter and a light receiver. According to the binding system, a first alignment hole is formed in the binding pressing head, the display panel is provided with an alignment marker, and a second alignment hole is formed in the supporting platform; a position and/or a posture of the binding pressing head, the position and/or the flatness of a binding region of the display panel, and an alignment degree between the binding pressing head and the display panel are monitored in real time by utilizing the light transmitter and the light receiver, so that the binding pressing head, the display panel, and the alignment degree between the binding pressing head and the display panel can be adjusted in real time; and the binding alignment accuracy is improved, the binding effect is optimized, the binding efficiency is improved, the rejection rate is reduced, and the yield of products is improved.

Description

technical field [0001] Embodiments of the present disclosure relate to a binding device, a display panel, a binding system and an operation method of the binding system. Background technique [0002] In the display device, the two ends of the flexible circuit board are usually bound to the binding area of ​​the display panel and the binding area of ​​the driving printed circuit board respectively by using a bonding process to realize the electrical signal between the driving printed circuit board and the display panel. Connection. Commonly used connection methods include: FPC technology (Flexible Printed Circuit), FFC technology (Flexible Flat Cable), COG technology (Chip On Glass, that is, the technology in which the chip is directly bound on the glass) and COF technology (Chip OnFilm, that is, the chip is technology mounted directly on flexible printed circuit boards), etc. [0003] Usually, when performing the binding process, first use pressure-sensitive paper to judge...

Claims

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Application Information

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IPC IPC(8): G02F1/13
CPCG02F1/1303G02F1/13452H01L21/67259G02F1/13H01L2224/759H01L23/544H01L22/20
Inventor 李东熙袁剑峰李炜强
Owner FUZHOU BOE OPTOELECTRONICS TECH CO LTD
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