Unlock instant, AI-driven research and patent intelligence for your innovation.

Transceiver-balancing wide band combination type ultrasonic transducer surface array probe and production method thereof

An ultrasonic transducer and wide-band technology, which is applied in the structural design and preparation of capacitive micro-electromechanical ultrasonic transducers, can solve problems such as weak transmission capabilities, and achieve the effects of balanced transceiver performance, high sensitivity, and reasonable design

Inactive Publication Date: 2017-05-31
ZHONGBEI UNIV
View PDF10 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the CMUT is used in a transceiver integrated system, the transmission capability is weak under the same conditions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transceiver-balancing wide band combination type ultrasonic transducer surface array probe and production method thereof
  • Transceiver-balancing wide band combination type ultrasonic transducer surface array probe and production method thereof
  • Transceiver-balancing wide band combination type ultrasonic transducer surface array probe and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0043] A wide-band hybrid ultrasonic transducer area array probe with balanced transmission and reception. Multiple array elements are arranged in rows and columns to form a CMUT area array probe. The area array can be arranged as M*N, where M can take a value 16~512, N can be 16~512.

[0044] like figure 2 As shown, it represents a cross-sectional view of an array element (element), including a silicon substrate 1, the upper surface of the silicon substrate 1 is an oxide layer 2, and the upper surface of the oxide layer 2 is provided with a number of cylindrical cavities 3, the cylinder Shaped cavities 3 are arranged in rows, columns or diagonally, the upper surface of the oxide layer 2 is bonded with a vibrating film 4, and the upper surface of the vibrating film 4 is provided with an isolation layer 5, surrounding the surrounding edges of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a transceiver-balancing wide band combination type ultrasonic transducer surface array probe which comprises a silicon substrate (1). An oxidation layer (2) is arranged on the upper surface of the silicon substrate (1), a plurality of cavities 93) are formed in the upper surface of the oxidation layer (2) and are arranged in rows and columns, a vibration membrane (4) is bonded on the upper surface of the oxidation layer (2), an isolation layer (5) is arranged on the upper surface of the vibration membrane (4), sinking isolation grooves (6) are formed around the inside and peripheral edge of the isolation layer (6), and the isolation grooves (6) penetrate the isolation layer (5) and the vibration membrane (4) with bottoms formed in the oxidation layer (2); electrodes (7) are arranged at central positions rightly facing to the cavities (3) on the upper surface of the isolation layer (5). The transceiver-balancing wide band combination type ultrasonic transducer surface array probe is novel in structure, small in size, wide in band, high in flexibility, low in nose, good in stability and balancing in transceiving performance.

Description

technical field [0001] The invention relates to a capacitive micro-mechanical ultrasonic transducer in the field of MEMS sensors, in particular to a structural design and a preparation method of a capacitive micro-mechanical ultrasonic transducer for ranging and imaging, which has the characteristics of balanced sending and receiving capabilities. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS, Micro-electromechanical Systems) and micro-nano technology, the manufacture of sensors has entered a new stage. At present, there are mainly three types of ultrasonic sensors: piezoelectric, piezoresistive and capacitive. Among them, the capacitive micro-machined ultrasonic transducer (CMUT) is flexible in design and processing, is less affected by temperature, responds to a wide frequency band, has a good matching between the production material and the dielectric impedance, and is easy to array processing. The integrated circuit ca...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B81B3/00B81C1/00G01S7/521B06B1/02
CPCB81B3/0021B06B1/02B81C1/00158G01S7/521
Inventor 何常德薛晨阳张文栋张斌珍贾利成
Owner ZHONGBEI UNIV