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A kind of halogen-free resin composition and the prepreg and copper-clad board made thereof

A technology of resin composition and prepreg, which is applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of high cost and high price, and achieve the effect of low production cost and low price.

Active Publication Date: 2019-03-15
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of phosphorus-containing epoxy resin is generally higher, which greatly increases its cost.

Method used

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  • A kind of halogen-free resin composition and the prepreg and copper-clad board made thereof
  • A kind of halogen-free resin composition and the prepreg and copper-clad board made thereof
  • A kind of halogen-free resin composition and the prepreg and copper-clad board made thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of bisphenol A epoxy resin (epoxy value 0.18-0.22), 18 parts of novolak resin, 2-ethyl-4-methyl 0.1 part of imidazole, 5 parts of aluminum hydroxide, 8 parts of titanium dioxide, 10 parts of aluminum diethyl hypophosphite, 35 parts of methyl ethyl ketone.

Embodiment 2

[0024] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of bisphenol A epoxy resin (epoxy value 0.51-0.54), 25 parts of novolak resin, 0.16 parts of 2-methylimidazole, 10 parts of aluminum hydroxide, 8 parts of titanium dioxide, 10 parts of aluminum diethyl hypophosphite, and 40 parts of methyl ethyl ketone are mixed to make a resin glue.

Embodiment 3

[0026] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of novolac epoxy resin (epoxy value 0.51-0.54), 50 parts of 4,4-diaminodiphenyl sulfone, 2-phenylimidazole 3 parts, 10 parts of aluminum hydroxide, 2 parts of titanium dioxide, 3 parts of aluminum methylcyclohexyl phosphinate, 15 parts of dimethylformamide, 25 parts of propylene glycol monomethyl ether, mixed into a resin glue.

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Abstract

The invention relates to a halogen-free resin composition and a prepreg and a copper-clad plate produced therefrom. The halogen-free resin composition comprises the following components: 100 parts of halogen-free non-phosphorus epoxy resin, 2-50 parts of curing agent, 0.1-3 parts of curing accelerator, 15-28 parts of flame retardant, and 35-55 parts of solvent. The resin composition in the invention is simple in process and low in production cost. The resin composition is halogen-free and may achieve a 'green' flame-retarding effect. A copper-clad plate produced according to the invention has the characteristics of high CTI greater than or equal to 600 V and high peel strength greater than or equal to 1.90 N / mm.

Description

technical field [0001] The invention relates to a halogen-free resin composition and a prepreg and a copper-clad laminate made of the same, belonging to the technical field of copper-clad laminate manufacture. Background technique [0002] As we all know, the flame retardancy of traditional copper-clad laminates has always relied on brominated epoxy resin and its synergist-antimony trioxide, which has played an indispensable role in composite-based copper-clad laminates and has become a solution for copper-clad laminate developers. A burning weapon. However, with the discovery of research, the halogen-antimony flame retardant has been proved to be harmful to human health and the environment. Therefore, the development of new environmentally friendly halogen-free flame retardant technology has become the general trend. At present, the more common practice in China is to use phosphorus-containing epoxy resin, and use the strong dehydration and carbonization of metaphosphoric...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/04C08K13/02C08K3/22C08K5/5313C08K13/04C08K7/14C08J5/24B32B15/092B32B15/20
CPCB32B15/092B32B15/20B32B2311/12B32B2363/00C08J5/24C08J2363/00C08J2363/04C08K3/22C08K5/5313C08K7/14C08K13/02C08K13/04C08K2003/2227C08K2003/2241C08K2201/003C08L2201/02C08L63/00C08L63/04
Inventor 高淑丽李宝东郑宝林徐树民王天堂赵东刘文江周鸥陈晓鹏陈长浩朱义刚姜晓亮
Owner SHANDONG JINBAO ELECTRONICS