A kind of halogen-free resin composition and the prepreg and copper-clad board made thereof
A technology of resin composition and prepreg, which is applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of high cost and high price, and achieve the effect of low production cost and low price.
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Embodiment 1
[0022] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of bisphenol A epoxy resin (epoxy value 0.18-0.22), 18 parts of novolak resin, 2-ethyl-4-methyl 0.1 part of imidazole, 5 parts of aluminum hydroxide, 8 parts of titanium dioxide, 10 parts of aluminum diethyl hypophosphite, 35 parts of methyl ethyl ketone.
Embodiment 2
[0024] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of bisphenol A epoxy resin (epoxy value 0.51-0.54), 25 parts of novolak resin, 0.16 parts of 2-methylimidazole, 10 parts of aluminum hydroxide, 8 parts of titanium dioxide, 10 parts of aluminum diethyl hypophosphite, and 40 parts of methyl ethyl ketone are mixed to make a resin glue.
Embodiment 3
[0026] A halogen-free resin composition, comprising the following components in parts by weight: 100 parts of novolac epoxy resin (epoxy value 0.51-0.54), 50 parts of 4,4-diaminodiphenyl sulfone, 2-phenylimidazole 3 parts, 10 parts of aluminum hydroxide, 2 parts of titanium dioxide, 3 parts of aluminum methylcyclohexyl phosphinate, 15 parts of dimethylformamide, 25 parts of propylene glycol monomethyl ether, mixed into a resin glue.
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