High-efficiency compact magnetic control film plating device and method

Abstract

The invention discloses a high-efficiency compact magnetic control film plating device and a method. The device comprises a rough extracting chamber, a finish extracting chamber and at least one film plating chamber connected in sequence in a substrate conveying direction; an S-shaped plane target is arranged in the film plating chamber; in the plane target, an inner concave cavity is formed in the middle part of a target base; a magnetic guide plate is arranged at the bottom of the inner concave cavity; an outer-ring magnet and an inner-ring magnet are distributed on the magnetic guide plate; the outer-ring magnet surrounds the outer periphery of the inner-ring magnet; and the outer-ring magnet and the inner-ring magnet are both S-shaped. The method comprises the following steps: after a substrate is placed on a substrate support plate, the substrate is fed in the rough extracting chamber, the finish extracting chamber and the film plating chamber in sequence from a substrate access platform by a substrate conveying mechanism; in the film plating chamber, a film is plated on the surface of the substrate by the S-shaped plane target; after the film is plated, the substrate is discharged from the rough extracting chamber, the finish extracting chamber and the film plating chamber in sequence by the substrate conveying mechanism, and is finally, fed in the substrate access platform; and the feeding direction of the substrate is opposite to the discharge direction. The device has the characteristics of compact equipment structure and high film plating efficiency.

Description

technical field [0001] The invention relates to the technical field of vacuum coating, in particular to an efficient and compact magnetron coating device and method. Background technique [0002] At present, linear vacuum coating equipment is generally used for the coating processing of large-area glass workpieces, that is, multiple vacuum chambers, workpiece inlet and outlet platforms, and wafer outlet platforms are arranged in a straight line. It is sent in from one end, and after the coating is completed, it is sent out from the other end of multiple vacuum chambers; at the same time, in this coating equipment, a flat target is generally used to coat the workpiece. In actual processing and production, coating equipment with this structure often has the following defects: [0003] (1) The traditional planar target is a flat structure with a small area. When the area of ​​the substrate to be processed is large, multiple planar targets need to be spliced. However, when mult...

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Problems solved by technology

[0003] (1) The traditional planar target is a flat structure with a small area. When the area of ​​the substrate to be processed is large, multiple planar targets need to be used for splicing. However, when multiple planar targets are spliced ​​together, there will be an electric field. The magnetron interferes with each other, which affects the stable discharge of the planar target, so the surface of the processed substrate will have uneven coating, which will affect its processing quality;

[0004] (2) In the traditional linear vacuum coating equipment, the substrate is sent in from one end of multiple vacuum chambers and sent out from the other end. The production line length of this structure is relatively large. It is necessary to set up a rough pumping chamber and a fine pumping chamber for the transition of the substrate into and out of the film, so the coating equipment in the vacuum chamber occupies a large area and the cost of the equipment is also high; in addition, each vacuum chamber also needs to be equipped with a corresponding vacuum unit. With the increase of the number of vacuum chambers, the number of configurations of vacuum pumping units is also large, which further increases the cost of equipment; in addition, due to the large length of the production line, the equipment with this structure has a long production cycle and low production efficiency, which is not conducive to controlling production costs

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