Rotary magnetron target and horizontal magnetron sputtering coating equipment

A magnetron target and rotary technology, applied in sputtering coating, ion implantation coating, vacuum evaporation coating, etc., can solve the problem of prolonging the coating cycle of the vacuum coating system, difficulty in improving the coating efficiency, and affecting the coating effect of new workpieces and other problems, to achieve the effect of shortening the workpiece coating cycle, shortening the production cycle, and shortening the cycle cycle
CN105908146BActive Publication Date: 2018-08-24ZHAOQING KERUN VACUUM EQUIP

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
ZHAOQING KERUN VACUUM EQUIP
Publication Date
2018-08-24

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Abstract

The invention discloses a rotary magnetron target and horizontal magnetron sputtering coating equipment. The rotary magnetron target comprises a target, a magnetic core and a magnet, wherein the magnetic core is arranged at the middle part of the target, at least one magnet is arranged at the periphery of the magnetic core, and one end facing the target, of the magnet, is conical. The horizontal magnetron sputtering coating equipment comprises a front pre-pumping chamber, a front rough-pumping chamber, a front fine-pumping chamber, a front buffering chamber, a coating chamber, a rear buffering chamber, a rear fine-pumping chamber, a rear rough-pumping chamber and a rear pre-pumping chamber which are sequentially connected, wherein one or more coating chambers are provided, and one rotary magnetron target is arranged in each coating chamber, and located above a workpiece. According to the rotary magnetron target, the tail end of the magnet is designed to be a tip, thus the distribution density of magnetic force lines on the surface of the target is enhanced, and the number of the sputtered target particles can be increased, and then the coating efficiency of the surface of the workpiece is increased. The rotary magnetron target is applied to the horizontal magnetron sputtering coating equipment, thus the coating efficiency of the workpiece can be effectively increased, and the production cycle of a whole process line is shortened, and then the production efficiency is increased.
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Description

technical field

[0001] The invention relates to the technical field of magnetron sputtering coating, in particular to a rotary magnetron target and a horizontal magnetron sputtering coating device with the rotary magnetron target. Background technique

[0002] In the magnetron sputtering coating system, a planar magnetron target or a rotating magnetron target is generally used in the coating chamber to sputter and coat the surface of the workpiece. Among them, the rotary magnetron target coating is to rely on electrons to hit argon molecules to turn them into argon ions, and then under the action of magnetic and electric fields, argon ions bombard the surface of the target at high speed, and the required materials are converted into ions and molecules. Splash out, plated on the surface of the workpiece. At present, in the general-purpose rotary magnetron target, the end of the magnet is generally a planar structure. In actual production, the distribution of the magnetic fie...

Claims

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