Electric-conducting and heat-conducting thin-film component

A technology of thin film components, electrical conduction and heat conduction, applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve the problems of incompetent thickness of parts, poor heat dissipation and temperature uniformity, etc., and achieve the reduction of thickness of parts, thin thickness Effect

Pending Publication Date: 2017-05-31
上海增华电子科技有限公司
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  • Abstract
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Problems solved by technology

However, in this heat dissipation method, since the copper foil or graphite is not in direct contact with the heat source, there is a certain air layer in the middle, resulting in poor heat dissipation and temperature uniformity.
[0004] Another common heat dissipation design example of traditional mobile phones is to use heat pipes supplemented by heat transfer glue to adhere to the stainless steel structure

Method used

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  • Electric-conducting and heat-conducting thin-film component

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Example Embodiment

[0018] See figure 1 As shown, a conductive and heat-conducting film assembly includes a heat source 1 and a heat-conducting film 2 , and the heat-conducting film 2 covers the surface of the heat source 1 . The heat conducting film 2 is a synthetic material composed of graphene and / or metal.

[0019] The graphene material is carbon 60, carbon 70, graphene, carbon nanotubes, carbon fiber, graphite, diamond-like carbon or a thin film composed of at least one of the above materials. The metal is aluminum, copper, copper, brass, silver, gold, magnesium, zinc, iron, stainless steel, titanium or an alloy formed by at least one of the above metals. The synthetic material of the graphene material and metal is that the graphene material is grown on the metal surface, or the metal is deposited on the graphene material surface, or the graphene material is deposited on the metal surface, or the graphene material and the metal are mixed in any proportion formed film. The metal material i...

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Abstract

The invention discloses an electric-conducting and heat-conducting thin-film component. The electric-conducting and heat-conducting thin-film component comprises a heat source and a heat-conducting film, wherein the heat-conducting film is covered on the surface of the heat source. The heat-conducting thin-film material provided by the invention can achieve thinner thickness besides excellent heat-conducting property; the heat-conducting thin-film material can be adhered on the heat source, so that the entire parts thickness can be effectively reduced, but the radiating performance cannot be influenced.

Description

technical field [0001] The invention relates to a thermally conductive material, in particular to a conductive and thermally conductive film assembly. Background technique [0002] Mobile communication devices such as mobile phones and portable 3C products, due to the high-speed computing and space constraints of electronic components, generate waste heat and local high temperatures that are difficult to dissipate, resulting in frequency reduction of CPU / APU chips and overheating of parts; in addition, high-power light-emitting diodes ( LED) will also generate a lot of heat during operation, of which up to 60-70% of the energy is mainly converted into heat energy in the form of lattice vibrations that occur in non-radiative recombination, and the high temperature generated during the operation of these LEDs will be lost if it cannot be effectively exported. Weaken luminous efficiency and reduce LED service life. Based on the heat conduction requirements of most products tod...

Claims

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Application Information

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IPC IPC(8): H01L23/373
CPCH01L23/373H01L23/3736H01L23/3738
Inventor 邱立凡邱启东
Owner 上海增华电子科技有限公司
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