Electric-conducting and heat-conducting thin-film component

Abstract

The invention discloses an electric-conducting and heat-conducting thin-film component. The electric-conducting and heat-conducting thin-film component comprises a heat source and a heat-conducting film, wherein the heat-conducting film is covered on the surface of the heat source. The heat-conducting thin-film material provided by the invention can achieve thinner thickness besides excellent heat-conducting property; the heat-conducting thin-film material can be adhered on the heat source, so that the entire parts thickness can be effectively reduced, but the radiating performance cannot be influenced.

Description

technical field [0001] The invention relates to a thermally conductive material, in particular to a conductive and thermally conductive film assembly. Background technique [0002] Mobile communication devices such as mobile phones and portable 3C products, due to the high-speed computing and space constraints of electronic components, generate waste heat and local high temperatures that are difficult to dissipate, resulting in frequency reduction of CPU / APU chips and overheating of parts; in addition, high-power light-emitting diodes ( LED) will also generate a lot of heat during operation, of which up to 60-70% of the energy is mainly converted into heat energy in the form of lattice vibrations that occur in non-radiative recombination, and the high temperature generated during the operation of these LEDs will be lost if it cannot be effectively exported. Weaken luminous efficiency and reduce LED service life. Based on the heat conduction requirements of most products tod...

AI Technical Summary

Problems solved by technology

However, in this heat dissipation method, since the copper foil or graphite is not in direct contact with the heat source, there is a certain air layer in the middle, resulting in poor heat dissipation and temperature uniformity.

[0004] Another common heat dissipation design example of traditional mobile phones is to use heat pipes supplemented by heat transfer glue to adhere to the stainless steel structure. Although this method can be directly adhered to the heat source, it can be more conductive than the example in Illustration 1. However, the heat pipe has a certain thickness, and under the effective heat conduction effect of the heat pipe, the overall thickness bottleneck of the heat pipe is 0.5mm, so that the overall thickness of the parts will not be able to handle the thickness reduction in the future.

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