A method for attaching a flexible substrate of an oled device and a flexible oled device

Abstract

The invention provides a method for attaching a flexible substrate of an OLED device and a flexible OLED device, wherein the method for attaching includes: coating a ring of sealant on the edge of the upper surface of a rigid carrier to form a glue frame, and then In this state, a flexible substrate with an area larger than the rigid carrier is covered and arranged on the lower surface of the rigid carrier, and is closely attached to the lower surface of the rigid carrier, and the flexible substrate is larger than the rigid carrier. Partially turned over to the upper surface of the rigid carrier, the edge of the flexible substrate is pasted on the upper surface of the rigid carrier through a glue frame, the sealant is cured, and a flexible OLED device is formed on the surface of the flexible substrate, The flexible OLED device is peeled off from the rigid carrier. The method for attaching the flexible substrate of the OLED device provided by the invention has an ingenious design method, and can tightly attach the flexible substrate to the rigid carrier without degassing and other processes.

Description

technical field [0001] The invention relates to a method for attaching a flexible substrate of an OLED device and a flexible OLED device. Background technique [0002] Organic Light-Emitting Diode (OLED) devices, as a new generation of displays, have attracted widespread attention due to their characteristics such as self-illumination, high brightness, wide viewing angle, low energy consumption, and bendability, and have been used in mobile phones. and on TV. The substrate of the OLED device does not require a backlight, and the organic material can be made to emit light by passing electricity to the organic material made on the glass. Because it is a very thin organic material for self-illumination, it makes flexible display possible. At present, plastic substrates such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET) are usually used in the production process of flexible display panels of OLED devices, but plastic substrates are easy to bend and defo...

AI Technical Summary

Problems solved by technology

At present, plastic substrates such as polyethylene naphthalate (PEN) or polyethylene terephthalate (PET) are usually used in the production process of flexible display panels of OLED devices, but plastic substrates are easy to bend and deform. , the process technology cannot be carried out alone

Therefore, it is necessary to flatly attach the plastic substrate to the non-deformable glass substrate to complete all the processes before peeling; the following process difficulties appear in the attaching process: 2. During the high-temperature process, the adhesive will have different degrees of outgassing and curing. The former will make the substrate uneven, and the latter will make the peeling of the final device change. very difficult

[0003] Since then, the method of attaching the plastic frame has also been proposed, such as figure 1 As shown, first coat the high-temperature-resistant curing glue in the form of a glue frame 2 on the carrier glass 1, attach the flexible substrate to the carrier glass 1, and when the process is completed, cut along the glass cutting line of the inner frame of the substrate 4 Carry out flexible device cutting to complete the peeling work of the device; even so, there is a certain height due to the curing glue, such as figure 2 As shown, the flexible substrate 3 still cannot be tightly attached to the carrier glass 1 after the surface of the carrier glass 1 is attached, and the flatness and residual gas will still affect the surface flatness of the flexible substrate during the process.

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