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Epoxy resin compositions and thermal interface materials comprising same

A technology of epoxy resin and composition, which is applied in the direction of heat exchange materials, electrical components, circuits, etc., can solve the problem of insulation and mechanical properties degradation, difficulty in showing resin composition properties, poor electronic insulation and flexibility of thermal interface materials , mechanical strength or heat resistance and other issues

Active Publication Date: 2017-06-13
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to make the thermal interface material have a better thermal conductivity value, the amount of thermal conductive powder added is usually greater than 80% by weight of the total composition. The more thermal conductive powder, the higher the thermal conductivity value. In this case, the resin The characteristics of the composition are often difficult to show, resulting in thermal interface materials with poor electronic insulation, flexibility, mechanical strength or insufficient heat resistance, which greatly limits their use
[0006] In order to overcome the degradation of insulation and mechanical properties of materials caused by adding too much thermal conductive powder, it is a challenge to develop a resin composition with high thermal conductivity.

Method used

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  • Epoxy resin compositions and thermal interface materials comprising same
  • Epoxy resin compositions and thermal interface materials comprising same
  • Epoxy resin compositions and thermal interface materials comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] Preparation of thermal interface material of the present invention (1)

[0086] Stir 2.12g of epoxy resin BEPB and 2.68g of DMAc (dimethylacetamide) to dissolve completely, then add 0.91g of epoxy resin 4032 and 0.99g of 4,4'-diaminodiphenyl Methane (MDA). After the above solutions are mixed evenly, take out 6g of the solution and add it to an aluminum pan, place it in an oven at 120°C for 2 hours, let it harden, then increase the temperature of the oven to 170°C, and bake for 40 minutes to dry the solvent to obtain heat. interface material. The physical properties of the above thermal interface materials, such as thermal conductivity, volume resistance, and breakdown voltage are listed in Table 1 below.

Embodiment 2

[0088] Preparation of thermal interface material of the present invention (2)

[0089] 2.68 g of epoxy resin BEPHMB and 3.05 g of DMAc were stirred to dissolve completely, and then 0.91 g of epoxy resin 4032 and 0.99 g of 4,4'-diaminodiphenylmethane (MDA) were added. After the above solutions are mixed evenly, take out 6g of the solution and add it to an aluminum pan, place it in an oven at 120°C for 2 hours, let it harden, then increase the temperature of the oven to 170°C, and bake for 40 minutes to dry the solvent to obtain heat. interface material. The physical properties of the above thermal interface materials, such as thermal conductivity, volume resistance, and breakdown voltage are listed in Table 1 below.

Embodiment 3

[0091] Preparation of thermal interface material of the present invention (3)

[0092] Stir 1.51g of epoxy resin BEPB and 2.95g of DMAc to dissolve completely, then add 1.32g of epoxy resin 5000, 0.6g of epoxy resin 4032 and 0.99g of 4,4'-diaminobis Benzene (MDA). After the above solutions are mixed evenly, take out 6g of the solution and add it to an aluminum pan, place it in an oven at 120°C for 2 hours, let it harden, then increase the temperature of the oven to 170°C, and bake for 40 minutes to dry the solvent to obtain heat. interface material. The physical properties of the above thermal interface materials, such as thermal conductivity, volume resistance, and breakdown voltage are listed in Table 1 below.

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Abstract

An epoxy resin composition is provided. The epoxy resin composition includes a first aromatic epoxy resin represented by formula (I), and an amino compound selected from a group that includes 4,4'-methylenedianiline, 4,4'-ethylenedianiline, 4,4'-bis(4-aminophenoxy)biphenyl and 1,4-bis(4-aminophenoxy)benzene, wherein the ratio between the epoxy groups of the first aromatic epoxy resin and the amino groups of the amino compound ranges from 1:1 to 2:1.

Description

[0001] 【Technical field】 [0002] The invention relates to an epoxy resin composition and a thermal interface material comprising the composition. [0003] 【Background technique】 [0004] In order to facilitate the design of electronic products in terms of multi-function, high speed and high power, thermal interface materials play a very critical role in thermal management design. How to increase the efficiency of heat transfer between components and heat sinks, the thermal conductivity and thermal impedance characteristics of the thermal interface material will play an important role. [0005] The resin composition of existing thermal interface materials is mostly epoxy resin, siloxane resin and polyimide resin, and then high thermal conductivity powder is added, such as ceramic powder such as alumina and boron nitride to improve thermal conductivity. It is then made into sheets, pads, strips, or films. In order to make the thermal interface material have a better thermal co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24C08G59/50C08L63/00
CPCC09K5/14C08G59/22C08G59/226C08G59/24C08G59/245C08G59/50C08G59/5033H01L23/3737C08G59/504C08L63/00
Inventor 刘彦群张惠雯曹翔雁邱国展
Owner IND TECH RES INST