Method for optimizing PCB microstrip line structure on basis of response surface methodology and genetic algorithm

A technology of response surface method and genetic algorithm, which is applied in the field of microelectronic packaging signal integrity, can solve problems such as transmission signal noise and interference, and achieve the effects of simple calculation, excellent robust performance, and convenient parameter optimization design

Active Publication Date: 2017-06-13
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

Parasitic effects can cause noise and interference on the transmitted signal, making signal integrity problems of high-speed interconnect structures more and more prominent

Method used

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  • Method for optimizing PCB microstrip line structure on basis of response surface methodology and genetic algorithm
  • Method for optimizing PCB microstrip line structure on basis of response surface methodology and genetic algorithm
  • Method for optimizing PCB microstrip line structure on basis of response surface methodology and genetic algorithm

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Embodiment

[0040] The method for optimizing the PCB microstrip line structure based on the response surface method and the genetic algorithm specifically includes the following steps:

[0041] (1) Establish the microstrip line simulation analysis model of HFSS, and the model substrate size is shown in Table 1;

[0042] (2) Obtain the return loss S11 and insertion loss S21 at a frequency of 1GHz-5GHz, such as figure 1 , 2 shown;

[0043] (3) Obtain the influencing factors affecting the microstrip line as follows: substrate thickness H1, microstrip line width t, microstrip line thickness H2, and substrate dielectric constant E; select three levels for each factor respectively, and the factor levels are as follows As shown in Table 2;

[0044] (4) Using BOX-Behnken's central combination design model, there are 29 groups of simulation model level combinations, of which 24 groups are analysis factors, and 5 groups are zero-point factors, that is, the parameter level combinations are the sa...

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Abstract

The invention provides a method for optimizing a PCB microstrip line structure on the basis of a response surface methodology and a genetic algorithm. The method comprises the steps that an electromagnetic simulation model of a PCB microstrip line is built on the basis of HFSS software; return loss and insertion loss of the microstrip line are obtained on the basis of the model; 29 tests are designed for computing simulation by taking the substrate thickness, the microstrip line width, the microstrip line thickness and the dielectric constant as design parameters and taking the return loss as a target value; the relationship, obtained in the tests under the 5-GHZ condition, between the return loss and the influence factors thereof is fit by adopting the response surface methodology; the obtained fit function is optimized by means of the globally optimal solution searching advantage of the genetic algorithm, and combined parameters with the minimal return loss are obtained. In addition, by means of HFSS simulation verification, the accuracy of an optimization result is proved, and the method has a guiding effect on optimization design of other interconnection structures.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging signal integrity, in particular to a method for optimizing a PCB microstrip line structure based on a response surface method and a genetic algorithm. Background technique [0002] With the rapid development of large-scale integrated circuits in the direction of high speed, high frequency and high density, the clock frequency can reach hundreds of MHz or even several GHz, the data rate can reach more than Gbps, and even tens of thousands of electronic components are integrated on the circuit board. . The transmission of signals between devices and between chips is inseparable from the interconnection structure, but as the density of components increases, the density of the interconnection structure becomes more compact, especially the microstrip line. The spacing has reached the um level. As the frequency increases, the density of the interconnection structure increases, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50G06N3/12
CPCG06N3/126G06F30/30G06F2111/06
Inventor 黄春跃黄根信
Owner GUILIN UNIV OF ELECTRONIC TECH
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