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Insulation board, insulation board system and insulation board system pouring method

A technology of thermal insulation board and thermal insulation layer, which is applied in the direction of thermal insulation, construction, building components, etc., and can solve problems such as poor safety performance, insulation board falling off, and easy piercing of vacuum insulation boards

Pending Publication Date: 2017-06-20
李明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a thermal insulation board, a thermal insulation board system and a pouring method for the thermal insulation board system, which can avoid the problem that the raised part of the wall is easy to pierce the vacuum insulation board, and at the same time, can also improve the insulation board from the wall easily. The upper part falls off, the safety performance is poor, and the problem that affects the construction quality

Method used

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  • Insulation board, insulation board system and insulation board system pouring method
  • Insulation board, insulation board system and insulation board system pouring method
  • Insulation board, insulation board system and insulation board system pouring method

Examples

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no. 1 example

[0032] Please refer to figure 1 , the present embodiment provides a thermal insulation board 100, which includes a first protective layer 110, a thermal insulation layer 120, and a second protective layer 130 stacked in sequence.

[0033] Wherein, the thermal insulation layer 120 is made of thermal insulation material and has thermal insulation effect. Further, the thermal insulation layer 120 may be an extruded board, a vacuum insulation board or the like. In this embodiment, preferably, the insulation layer 120 is a vacuum insulation panel.

[0034]Vacuum insulation panel (Vacuum insulation Panel, VIP) is a kind of vacuum insulation material. It is composed of filling core material and vacuum protection surface layer. It can effectively avoid heat transfer caused by air convection, so the thermal conductivity can be greatly reduced. , less than 0.003w / m.k, and does not contain any Ozone Depleting Substances (Ozone Depleting Substances, ODS) materials, with the characterist...

no. 2 example

[0049] According to the national standard, only two through holes can be opened on the vacuum insulation plate at most, and because the through holes for placing the pull bolts 240 are set according to the actual construction conditions, there are special requirements for the position. Therefore, if the insulation board The through holes provided on the 100 for placing the pull bolts 240 may not meet the requirements of actual construction.

[0050] In order to solve the problem of reserving the through holes for setting the pull bolts 240 on the insulation board 100, please combine Figure 6 and Figure 7 , this embodiment provides a thermal insulation board system 200, which includes thermal insulation mortar and any one of the thermal insulation boards 100 in the first embodiment.

[0051] Each of the thermal insulation boards 100 includes a first cross section 140 and a second cross section 150, and the first cross sections 140 of every two adjacent thermal insulation boa...

no. 3 example

[0056] Please refer to Figure 8 , the present embodiment provides a method for pouring a thermal insulation board system, and the method is applied to the thermal insulation board system. The insulation board system includes insulation mortar and a plurality of insulation boards.

[0057] Each of the thermal insulation boards includes a first cross section and a second cross section, and the first cross sections of every two adjacent thermal insulation boards are bonded by the thermal insulation mortar to form a first mortar layer, and every two The second cross-sections of the adjacent thermal insulation boards are bonded by the thermal insulation mortar to form a second mortar layer, and a plurality of first mortar layers are reserved between each two adjacent thermal insulation boards. Two through holes. The second through hole is used for placing the pull bolts.

[0058] Each of the insulation boards includes a first protective layer, a thermal insulation layer made of...

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Abstract

The embodiment of the invention provides an insulation board, an insulation board system and an insulation board system pouring method, and relates to the field of building construction. The insulation board comprises a first protective layer, an insulation layer and a second protective layer which are sequentially overlapped, and the insulation layer is made of insulation materials. The first protective layer and the second protective layer have a protection function for the insulation layer. A plurality of grooves are formed in the surface, far away from the insulation layer, of the first protective layer. A first through hole penetrating through the first protective layer, the insulation layer and the second protective layer sequentially is formed in the center of each groove. The first through holes are used for arrangement of anchoring bolts. The insulation board can avoid the problem that protruding parts of a wall body are prone to impale a vacuum insulation board, and meanwhile relieve the problems that the insulation board is prone to fall off the wall body, the safety performance is poor, and the construction quality is affected.

Description

technical field [0001] The invention relates to the field of building construction, in particular to a thermal insulation board, a thermal insulation board system and a pouring method for the thermal insulation board system. Background technique [0002] Building insulation is mainly to reduce the indoor heat of the building from being emitted to the outside, and it is an important measure to create a suitable indoor thermal environment and save energy. For the construction industry, traditional building insulation is generally pasted with vacuum insulation panels on the outer wall of the wall. Due to the unevenness of the wall itself to form multiple protrusions or depressions, during the pasting process, the raised parts of the wall can easily pierce the vacuum insulation board, resulting in a greatly reduced insulation effect of the vacuum insulation board; at the same time, the method of pasting Fixing the vacuum insulation board on the wall makes the vacuum insulation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80E04B1/76E04G21/00
CPCE04B1/762E04B1/80E04G21/00Y02A30/242Y02B80/10
Inventor 李明
Owner 李明