A method and device for removing glue from a heat sink of a semiconductor device

Abstract

The invention discloses a glue cleaning method and apparatus of a heat sink of a semiconductor device. The glue cleaning method of a heat sink of a semiconductor device includes the steps: S1, putting a semiconductor device in chemical solution to soften the spilled glue on the surface of a heat sink; and S2, utilizing a rotation hair brush to brush off the softened spilled glue on the surface of the heat sink, wherein as the spilled glue is softened, even if the glue-spilling situation is serious, the rotation hair brush can quickly clean the spilled glue, and as the spilled glue is softened, for the rotation hair brush, a common hair brush is enough and a wear resistant special hair brush is not necessary. Therefore, the cost is saved and the surface of the heat sink is not worn. And the glue cleaning method and apparatus of a heat sink of a semiconductor device are labour saving and time saving, and can improve the work efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a glue removing method and a glue removing device for a radiator plate of a semiconductor device. Background technique [0002] After the semiconductor lead frame is packaged with epoxy resin, due to design problems, some products will have overflow glue remaining on the lead pins and heat sink, which needs to be removed before subsequent tin plating. The methods of removing overflow glue are mainly chemical solution immersion method (Chemical Deflush), electrolysis method (Electrolisis Deflush) and mechanical method (Michenical Deflush). Mechanical methods are now rarely used because the blasting media used can damage the substrate. The electrolysis method is mainly to separate the overflow glue from the surface of the heat dissipation plate by electrolysis to generate gas on the surface of the heat sink. When the electrolysis voltage or current is too high, the chip wil...

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Problems solved by technology

It can be seen from the description of the comparative document that it mainly punches and removes the residual glue on the burr on the side of the semiconductor, and cannot remove the residual glue on the heat sink, and using a tool to forcibly remove it may damage the semiconductor components themselves, and It is equivalent to a grinding process when the special brush containing diamond sand wear-resistant polishing removes the remaining residual glue. It grinds off the residual glue on the surface. It is not only inefficient to directly polish the solid residual glue, but also may cause damage to semiconductor devices.

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