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Optical solid state prepolymers and molding compositions

A molding composition and prepolymer technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of light and heat resistance, the inability to effectively improve the light and heat resistance of thermoplastic materials, and the inability to apply high-power PLCC LED components, etc.

Active Publication Date: 2019-04-23
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermoplastic resin PPA (polyphthalamide) reflective cup material traditionally used in PLCC LED components has problems such as light and heat resistance and easy yellowing, so it cannot be applied to high-power PLCC LED components
In recent years, thermoplastic materials also include new injection materials PCT (polyester (polyester) series), but it is still unable to effectively improve the properties of thermoplastic materials that are not resistant to light and heat and easy to yellow

Method used

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  • Optical solid state prepolymers and molding compositions
  • Optical solid state prepolymers and molding compositions
  • Optical solid state prepolymers and molding compositions

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0027] Table 1 is the names, structures, and sources of the starting materials used in the examples.

[0028] Table 1 (mainly used drug list)

[0029]

[0030]

Synthetic example 1

[0031] Synthesis example 1 (SEP-1, linear silicone epoxy resin)

[0032] Add 9.93g of 4-ethylene-1-cyclohexene-1,2-epoxide, 10ppm trithiobutyl ether rhodium trichloride, and 0.0015g of N,N-dioctadecylmethylamine to 250ml In a double-necked reaction flask, add 50 mL of toluene and stir and heat to 100 °C. Then, at 100° C., 19.5 g of HMS-301 (Methylhydrosiloxane, purchased from Gelest) was added dropwise. After the HMS-301 drops, raise the temperature to 115°C and stir, and use FT-IR to monitor the reaction mixture at 2160cm -1 Whether the absorption peak (-SiH) at the place disappears, to judge whether the reaction is complete. After the reaction was complete, the temperature was lowered to room temperature. Carbon black is then added to the crude and stirred for purification. Finally, the carbon black was removed by filtration, and the toluene in the filtrate was removed by a rotary concentrator to obtain SEP-1.

Synthetic example 2

[0033] Synthesis Example 2 (SEP-2, Cyclic Siloxane Epoxy Resin)

[0034] Take 59.52g of 4-ethylene-1-cyclohexene-1,2-epoxide, 10ppm trithiobutyl ether rhodium trichloride, and 0.0015g of N,N-dioctadecylmethylamine into 250mL In a double-necked reaction flask, add 50 mL of toluene and stir and heat to 100 °C. Then, at 100° C., 24 g of 1,3,5,7-tetramethylcyclotetrasiloxane (SIT7530, purchased from Gelest) was added dropwise. After the SIT7530 drops, raise the temperature to 115°C and stir, and use FT-IR to monitor the reaction mixture at 2160cm -1 Whether the absorption peak (-SiH) at the place disappears, to judge whether the reaction is complete. After the reaction was complete, the temperature was lowered to room temperature. Carbon black is then added to the crude product and stirred for purification. Finally, the carbon black was removed by filtration, and the toluene in the filtrate was removed by a rotary concentrator to obtain SEP-2.

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PUM

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Abstract

The optical solid prepolymer provided by the present invention comprises: the reaction product of 100 parts by weight of (a) epoxy resin and 0.1 to 30 parts by weight of (b) oligomeric silsesquioxane silanol, wherein (a) Epoxy resins include (a1) linear silicone epoxy resins and (a2) cyclic silicone epoxy resins, and (a1) linear silicone epoxy resins and (a2) cyclic silicone epoxy resins The weight ratio is between 1:1 and 5:1.

Description

【Technical field】 [0001] The present invention relates to molding compositions and more particularly to the composition of optically solid prepolymers they comprise. 【Background technique】 [0002] Light-emitting diodes (LEDs) have many advantages such as energy saving, small size, long life, fast response, low pollution, high reliability, and large module flexibility, so they are widely used. In recent years, with the continuous advancement of technology, the efficiency and brightness of LEDs have been continuously improved, making their application scope gradually extended to display backlight modules, automotive light sources, and general lighting. At present, it has gradually replaced the existing fluorescent lamps and become a new generation of lighting sources. High-power and high-brightness LEDs have also become the mainstream of development, and their demand will also increase day by day. The existing thermosetting epoxy molding composition (EMC) material is mainly...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K7/08C08G59/42
CPCC08G59/4223C08K7/08C08L2203/206C08L63/00C08G77/045C08G77/14C08G77/16C08L83/06H01L33/56C08L83/00C08J5/00C08J2383/04C08J2483/04C08L83/04
Inventor 詹英楠黄淑祯林志浩陈文彬陈凯琪
Owner IND TECH RES INST