a mg 2 sio 4 -li 2 tio 3 Composite system LTCC material and preparation method thereof
A system and raw material technology, applied in the field of microwave electronic ceramic materials and their manufacturing, can solve the problems of high sintering temperature, the temperature coefficient of resonant frequency deviates from zero, and can not meet the application requirements, and achieves the effect of high application prospect and value
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023] The present invention will be described in further detail below with reference to the accompanying drawings.
[0024] Step 1: Combine analytically pure MgO and SiO 2 Molar ratio MgO:SiO 2 = 2:1 Weighing and configuring raw materials; ball mill the prepared raw materials once to mix the raw materials evenly, add deionized water according to the mass ratio of powder and deionized water at 1:1, and ball mill for 4 hours at the ball milling speed of 300rpm. After ball milling, dry the powder at 120°C for later use.
[0025] Step 2: Pass the dried powder obtained in Step 1 through a 60-mesh sieve, put it into a crucible for compaction, and heat it up to 1350°C at a rate of 2°C / min for pre-burning, keep it warm for 4 hours, and cool with the furnace get Mg 2 SiO4 Pre-fired.
[0026] Step 3: Add analytically pure Li 2 CO 3 and TiO 2 Moore Billy 2 CO 3 :TiO 2 = 2:1 Weighing and configuring raw materials; ball mill the prepared raw materials once to mix the raw materia...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com