LED illuminating device and manufacturing method thereof

Abstract

The invention provides an LED illuminating device and a manufacturing method thereof. The LED illuminating device is mainly characterized in that a metal sheet is stamped and formed into a current-conducting plate with a 3D space, the current-conducting plate is provided with an illuminating circuit, then the current-conducting plate is supported through a supporting frame, and the illuminating device of multiple types is formed. The supporting frame is used for supporting and fixing the current-conducting plate, and the solid curve surface of the formed space of the current-conducting plate is facilitated. The LED illuminating device is further provided with an LED chip welding point protection mechanism used for protecting all LED chip welding points. The LED illuminating device can be suitable for mass production, the manufacturing yield of the device can be increased, and the demands of high radiating efficiency, large illuminating area, material saving, light weight or/and environment protection can be met.

Description

technical field [0001] The present invention relates to a light-emitting diode lighting device, in particular to an LED lighting device and a manufacturing method thereof mainly using a stamping forming technology to form a lighting circuit structure. Background technique [0002] LED lighting devices often use packaged LED chips as light-emitting components. Common packaging forms include: DIP packaged LEDs, SMD packaged LEDs, COB packaged LEDs, CSP packaged LEDs, etc. The above various forms of packaged LEDs are hereinafter referred to as LED chips. ;In addition to the conductive electrode contacts, the LED chip sometimes also has a heat transfer point to accelerate heat conduction to the outside. In many cases, multiple LED bare crystals are packaged on a large aluminum substrate in order to increase the lighting power. Most are much larger than the size of the LED die, also known as large aluminum substrate package. [0003] The common functional requirements and known ...

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Problems solved by technology

[0004] Chinese patent CN102494257A, a large-angle LED bulb with natural convection heat dissipation inside and outside the air. In this case, the LED chip is attached to a polygonal heat dissipation column with multiple heat dissipation channels, and the air naturally circulates through the heat dissipation channels to dissipate heat. The heat dissipation column can only provide lighting in the direction of the circular circumference, and the scheme of other lighting ranges has not been proposed;

[0018] In the known sheet metal process, stamping is extended into a 3D structure and then cut to form a circuit to form a conductive plate similar to the present invention, but such a process is relatively fast in forming a spatial structure, but it is difficult to cut the circuit and then use it manually. LED chip bonding and soldering processes on three-dimensional curved surfaces lack advantages, and such solutions are limited by high mass production costs and low process reliability.

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