Wire-electrode cutting equipment and wire-electrode cutting method

Abstract

The invention provides wire-electrode cutting equipment and a wire-electrode cutting method. The wire-electrode cutting equipment comprises a cutting system and a workbench. The cutting system comprises a first working procedure device and a second working procedure device which share the same routing system. A walking guide rail and a workpiece carrying table arranged on the walking guide rail are laid on the workbench. In this way, a first working procedure operation and a second working procedure operation can be conducted at the same time through the cutting system, and operation efficiency of workpieces is improved. Moreover, as for the same workpiece, the workpiece can be transferred to a second working procedure station so as to execute the second working procedure operation subsequently after the first working procedure operation is executed, the transferring process of the workpieces is simplified, and the transferring efficiency of the workpieces is improved; and seamless continuous execution of the multiple working procedure operations even can be achieved, the number of the working procedures is reduced, operation efficiency of the working procedures is improved, cost is reduced, errors are lowered, and the rate of finished workpieces is increased.

Description

technical field [0001] The present application relates to the technical field of wire cutting, in particular to a wire cutting device and a wire cutting method using silicon rods. Background technique [0002] When manufacturing various semiconductors and photovoltaic devices, semiconductor workpieces containing hard and brittle materials such as silicon, sapphire, or ceramics are cut into wafers of required thickness. Since wafer dicing is an important process that restricts subsequent finished products, the requirements for its operation are getting higher and higher. At present, multi-wire cutting technology is widely used in industrial crystal cutting production due to its high production efficiency, low operating cost, and high operating accuracy. [0003] Multi-wire cutting technology is currently a relatively advanced crystal cutting technology in the world. Its principle is to cut the crystal silicon workpiece to be processed by a high-speed moving diamond wire to f...

AI Technical Summary

Problems solved by technology

[0004] In view of the various deficiencies described above, the purpose of this application is to disclose a wire cutting device and a wire cutting method, which are used to solve the problems of low cutting efficiency and cumbersome and inconvenient workpiece transfer in the related art.

Images