Surface enhanced Raman scattering substrate and preparation method thereof
A surface-enhanced Raman and substrate technology, applied in Raman scattering, sputtering plating, ion implantation plating, etc., can solve the problems of low Raman signal amplification, high price of Raman chips, and low sensitivity, and achieve Effects of Sensitivity Improvement and Raman Enhancement Performance
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Embodiment 1
[0091] This embodiment provides a surface-enhanced Raman scattering SERS substrate, the SERS substrate consists of a 0.12 μm thick first SiO from bottom to top 2 Layer 1, 0.1 μm thick Ag layer with interstitial rings 3, 0.04 μm thick second SiO 2 Layer 4 and two identical 0.04 μm thick equilateral triangular silver flakes 5 (side length is 127nm);
[0092] Among them, the first SiO 2 Layer 1, Ag layer 3 with interstitial ring and second SiO 2 Layer 4 is a square of the same size, and the side length of the square is 1 μm.
[0093] In the Ag layer 3 with the void ring, the ring inner diameter of the void ring is 0.37 μm, and the outer diameter is 0.47 μm, then the width of the void ring is 100 nm; centers coincide.
[0094] 2 identical equilateral triangles are arranged with vertices facing each other, and these two opposite vertices are located on one central axis of the square, and are located on both sides of the other central axis of the square and are symmetrical; The...
Embodiment 2
[0105] This embodiment provides a SERS substrate, which is the same as the SERS in Embodiment 1 except that the bases of two identical equilateral triangles are 140 nm.
[0106] The preparation method of the SERS substrate of this embodiment, except that the base of the equilateral triangle in the step (6) is 140 nm, other preparation methods and conditions are the same as in the embodiment 1.
[0107] Test results: the maximum Raman signal enhancement factor of the SERS substrate of this embodiment is 4.47*10 12 .
Embodiment 3
[0109] This embodiment provides a SERS substrate, except that the inner diameter of the void ring is 0.45 μm and the outer diameter is 0.55 μm, the other contents are the same as those of the SERS in Embodiment 1.
[0110] The preparation method of the SERS substrate of this embodiment, except that the inner diameter of the ring region in step (1) is 0.45 μm and the outer diameter is 0.55 μm, other preparation methods and conditions are the same as in Example 1.
[0111] Test results: the maximum Raman signal enhancement factor of the SERS substrate of this embodiment is 8.89*10 12 .
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