Workpiece loading device capable of improving processed surface quality by wire saw cutting

Abstract

The invention discloses a workpiece loading device capable of improving processed surface quality by wire saw cutting. The workpiece loading device comprises a workbench and a loading table, wherein a vertical guiding rail is arranged on the workbench; the loading table is mounted on the guiding rail of the workbench; wheel discs are mounted on the workbench, and connected with a motor; the loading table is connected with the wheel discs through a connecting rod; and two ends of the connecting rod are respectively hinged with the loading table and the wheel discs. Through the adoption of the workpiece loading device disclosed by the invention, the loading table can make reciprocating motion relative to the workbench and the running direction of a diamond cutting wire in the process that a workpiece is cut, so that the purpose that equivalent cutting force on each of all points on the same chord length in one reciprocating cycle is basically consistent is realized, basically synchronous cutting of the points is realized, and the phenomenon that cutting lines are not parallel due to uneven distribution of cutting force is avoided; the function of facilitating cutting discharge is realized through the promotion of relative motion between a saw wire and the processed workpiece, and the phenomenon that because a cutting edge is too long, cutting chips accumulate at the middle part of the cutting edge, and the saw wire is severely worn or the surface quality of a cut slice is reduced is avoided.

Description

technical field [0001] The invention relates to a workpiece loading device which can improve the processing process and improve the surface quality of slices during the process of cutting bars by a wire saw, and belongs to the technical field of cutting processing. Background technique [0002] Silicon carbide (SiC), silicon (Si), sapphire and other hard and brittle crystal materials are widely used in various disciplines due to their excellent and stable physical and chemical properties. At present, the slicing process of these crystals generally uses the multi-wire saw cutting technology, which has the advantages of narrow kerf and high yield. The existing wire saw machine tool equipment generally clamps the workpiece to be cut on the feed worktable, and the saw wire (also called diamond wire) reciprocates, and the movement of the feed worktable drives the material to be processed along the direction perpendicular to the saw wire. Feed in the direction of the saw wire, or...

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at cutting the crystal rods with diamond wires. Due to the narrow slit, the chips close to the middle of the incision are difficult to discharge, and the end and middle of the incision on the same chord length cannot be cut synchronously. To solve outstanding problems such as non-parallel cutting lines, provide a workpiece loading device that accelerates chip discharge during the cutting process of a fixed abrasive wire saw, improves the processing process and improves the surface quality of the wire saw.

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