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Miniature multilayer ceramic low pass filter

A technology of low-pass filter and multi-layer ceramics, which is applied in the direction of multi-terminal pair network, impedance network, electrical components, etc., can solve the problem that the size and area of ​​the device cannot be effectively reduced, and achieve superior performance, low cost, and light weight Effect

Pending Publication Date: 2017-08-04
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional process technology cannot effectively reduce the size and area of ​​the device.

Method used

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  • Miniature multilayer ceramic low pass filter
  • Miniature multilayer ceramic low pass filter
  • Miniature multilayer ceramic low pass filter

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with accompanying drawing:

[0016] like Figure 1-4 As shown, the miniature multilayer ceramic low-pass filter of this embodiment includes a laminate composed of multilayer dielectric substrates and a filter circuit arranged in the laminate. Adjacent dielectric substrates are connected to each other through conductive bands and via holes. The dielectric substrate has at least one ground layer, and its surface is provided with an input terminal 1 and an output terminal 2. The filter circuit includes inductors L2, L4, L6 and capacitors C1, C2, and C3. The inductor L2 is connected in parallel with the capacitor C2. The parallel terminals are the a terminal connected to the input terminal 1 and the b terminal connected in series with the inductance L4, one end of the inductance L6 is connected to the inductance L4, the other end is connected to the output terminal 2, one end of the capacitor C1 is connect...

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PUM

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Abstract

The invention relates to a miniature multilayer ceramic low pass filter, comprising a cascading body formed by cascading multilayer dielectric substrates; and a filter circuit arranged in the cascading body. Adjacent dielectric substrates are interconnected and are switched on through conduction bands and via holes. At least one grounding layer is arranged in each dielectric substrate. An input end and an output end are arranged on the surface of each dielectric substrate. The filter circuit comprises inductors L2, L4 and L6 and capacitors C1, C2 and C3. The inductor L2 is connected with the capacitor C2 in parallel and the parallel connection ends comprise an a end and a b end. One end of the inductor L6 is connected with the inductor L4, and the other end is connected with the output end. One end of the capacitor C1 is connected with the a end, and the other end of the capacitor C1 is grounded. One end of the capacitor C3 is connected with the b end, and the other end of the capacitor C3 is grounded. The low pass filter provided by the invention is small in size, light in weight, excellent in performance and low in cost and is suitable for volume production. The low pass filter can be processed into a form of a patch, thereby facilitating integration into a microwave system.

Description

technical field [0001] The invention relates to a low-pass filter, in particular to a miniature multilayer ceramic low-pass filter. Background technique [0002] Low-pass filters are important passive components in the RF front-end. An excellent low-pass filter should have low in-band loss, deep out-of-band suppression, wide stop-band suppression range, and also need to have as small a volume as possible. The traditional low-pass filter adopts a planar structure and occupies a large area, which cannot meet the miniaturization requirements of the RF front-end. At the same time, the traditional low-pass filter is difficult to integrate. [0003] In order to meet the miniaturization requirements of devices, the initial method is to use dielectric materials with high dielectric constant, high quality factor, and low loss to reduce the size of the resonator, thereby reducing the volume of the device. However, the traditional process technology cannot effectively reduce the size...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H7/01
CPCH03H7/0153
Inventor 刘俊清于沛洋
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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