Light Emitting Diode Chip

Abstract

The invention provides a light emitting diode chip. The light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; an insulation layer covering the first conductive type semiconductor layer and the mesa, the insulation layer including at least one first opening exposing the first conductive type semiconductor layer and a second opening disposed on the mesa; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening. The first opening of the insulation layer includes a first region covered by the first pad electrode and a second region exposed outside the first pad electrode.

Description

technical field [0001] The invention relates to a small light emitting diode chip. Background technique [0002] Light-emitting diodes are used in various products such as large backlight units (BLU), general lighting, and electrical components, and are widely used in small home appliances and decorative products. [0003] In addition to simply being used as a light source, light-emitting diodes are also used for various purposes such as conveying information and highlighting aesthetics. Therefore, a degree of freedom in design of products using light emitting diodes is required. For example, it is necessary to mount light-emitting diodes on a flexible printed circuit board (Flexible Printed Circuits Board: FPCB) to freely change the shape of the product. In particular, there is a demand for products whose form can be freely changed according to the needs of consumers. [0004] However, the light emitting diode is made of, for example, gallium nitride-based single crystal...

AI Technical Summary

Problems solved by technology

However, it is difficult to process the lead wires on flexible substrates such as FPCB by forming grooves, etc. When the lead wires are grooved, when the form of the product is changed, the lead wires are prone to disconnection and the reliability of the product is reduced.

Furthermore, in the case of arranging small light emitting diodes at narrow intervals, grooves are formed in many parts of the leads, so the reliability is further reduced.

Images