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Combined type cleaning device and cleaning method

A cleaning device and a composite technology, which are applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problem of difficult to clean mesh plates with extremely fine meshes, hollow holes that are difficult to clean, and pollution. The problem of poor object removal effect, etc., achieves the effect of reducing the cost of rinsing loss, avoiding splash loss, and avoiding residual marks

Inactive Publication Date: 2017-08-18
深圳海易清洗科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Several traditional cleaning methods: 1) manual cleaning, not only wastes manpower, but also the hollow holes are not easy to clean, and it is easy to damage the screen; In addition, due to the limitations of the spraying method itself, a large amount of liquid will be splashed and atomized, and the liquid consumption is huge. It needs to consume 200-300ml cleaning liquid or even more for one cleaning; 3) There are simple ultrasonic cleaning equipment on the market, which can Fine meshes and crevices have cleaning advantages, but the removal effect on pollutants is poor, and the removal efficiency of a large amount of pollutants is low

Method used

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  • Combined type cleaning device and cleaning method
  • Combined type cleaning device and cleaning method
  • Combined type cleaning device and cleaning method

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Embodiment Construction

[0048] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0049] see figure 1 , a compound cleaning device and cleaning method of the present invention, outer cover 1, cleaning tank 2, rinsing tank 3 and drying tank 4, as the technical characteristics of the present invention: automatic transmission system, electric control system, circulating filtration system, etc. The cleaning tank 2, the rinsing tank 3 and the drying tank 4 are all located inside the outer cover 1, and a moving device is arranged above the cleaning tank 2, the rinsing tank 4 and the drying tank 3, and the moving device includes a lateral moving device 51 And vertically moving means 5...

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Abstract

The invention relates to a combined type cleaning device and a cleaning method. According to the combined type cleaning device and the cleaning method, the range of objects to be cleaned includes screen plates of the electronic industry, misprinted circuit boards, scrapers, post-weld printed circuit boards and the like; the range of pollutants to be removed includes non-cured tin paste, SMT printing glue, scaling powder residues, other impurities, dust, particles and the like; and the structure of the combined type cleaning device comprises a totally-enclosed outer cover, a cleaning tank, a rinsing tank, a drying tank, an automatic conveying system, an electric control system, a circulating filtration system and the like. Compared with the prior art, the brand new cleaning technology method and cleaning device combining various efficient technology means have the advantages that under the systematic and scientific guidance and on the basis of redefining that the essence of cleaning is to safely and effectively separate the objects to be cleaned and the pollutants, the cleaning strength, the environment-friendly safety and the operation cost economical efficiency are considered comprehensively and systematically.

Description

[0001] [technical field] [0002] The invention relates to a workpiece cleaning device, in particular to a composite cleaning device and a cleaning method. [0003] [Background technique] [0004] Electronic circuit surface mount technology (Surface Mount Technology, SMT), known as surface mount or surface mount technology. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering. [0005] In SMT equipment, there is a process that requires dispensing glue on the circuit board through the hollow hole of the stencil. Since the surface to be dispensed is extremely small and the hollow holes of the screen are also extremely small, the screen is extremely difficult to clean. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02B08B3/12B08B3/14B08B3/04B08B3/08B08B13/00F26B21/00
CPCB08B3/02B08B3/048B08B3/08B08B3/12B08B3/14B08B13/00F26B21/00
Inventor 戴素军
Owner 深圳海易清洗科技有限公司