Semiconductor chip with fracture detection

Abstract

The invention relates to semiconductor chips with fracture detection. The semiconductor chip (100) includes: a substrate (101), an integrated circuit (102), a concave portion (110) of the substrate (101), printed wires (121), and intersection between (111). This enables detection of a test signal which is fed into the conductor track ( 121 ). In various examples, a fracture of the substrate ( 101 ) in the region of the recess ( 110 ) can be detected.

Description

technical field [0001] Various embodiments relate to a semiconductor chip with a substrate, an integrated circuit, a recess of the substrate, conductor tracks and an intersection between the recess of the substrate and the conductor tracks. A further embodiment relates to a method comprising the detection of a test signal indicative of a break of the substrate of the semiconductor chip at the recess. Background technique [0002] Modern electronic systems use semiconductor chips comprising integrated circuits with defined functions on a substrate. The failure safety of the corresponding electronic systems must meet high requirements in different applications. For example, for automotive applications it may be necessary to meet relatively stringent requirements for failure safety, for example according to standard 26262 of the International Organization for Standardization (ISO). Typically, the failure safety of the respective electronic system is characterized by the react...

AI Technical Summary

Problems solved by technology

Lack of safety may occur if electronic systems continue to be used despite restricted functionality

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