Film forming method and film forming apparatus
A film-forming method and film-forming technology, applied in lighting devices, gaseous chemical plating, coatings, etc., can solve the problems of being thin and light, and achieve the effect of high moisture resistance and thin moisture resistance
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no. 1 approach
[0063] [Structure of Film Formation Apparatus 10 ]
[0064] figure 1 It is a longitudinal sectional view showing an example of the film forming apparatus 10 of the first embodiment. The film forming apparatus 10 is configured as a plasma processing apparatus using inductively coupled plasma (ICP: Inductively Coupled Plasma). The film forming apparatus 10 includes, for example, a rectangular tube-shaped airtight processing container 1 made of aluminum whose inner wall surface is anodized. The processing container 1 is assembled in a detachable manner, and is grounded through a ground wire 1a. The processing container 1 is vertically divided into an antenna chamber 3 and a processing chamber 4 by a dielectric wall 2 . The dielectric wall 2 forms the top wall of the processing chamber 4 . The dielectric wall 2 is for example made of Al 2 o 3 Such as ceramic or quartz composition.
[0065] A shower housing 11 for supplying process gas is fitted in a lower portion of the die...
no. 2 approach
[0121] Next, a second embodiment will be described. The sealing film of this embodiment is different from the sealing film of the first embodiment in that it has a multilayer structure. In addition, the structure and use of the film forming apparatus 10 used in this embodiment figure 1 as well as figure 2 The configuration of the film forming apparatus 10 of the first embodiment described above is the same, and thus detailed description thereof will be omitted. In addition, the outline of the manufacturing procedure of the light-emitting module 100 of this embodiment is also the same as the image 3 The outline of the manufacturing procedure of the light-emitting module 100 of the first embodiment described is the same, and therefore detailed description will be omitted except for the content described below.
[0122] [Structure of light emitting module 100]
[0123] Figure 7 It is a sectional view showing an example of the structure of the light emitting module 100 of ...
no. 3 approach
[0143] Next, a third embodiment will be described. The sealing film of the present embodiment is different from the sealing film of the second embodiment in that the fluorine-added second film 108 has a fluorine concentration gradient in the thickness direction. In addition, the structure and use of the film forming apparatus 10 used in this embodiment figure 1 as well as figure 2 The film formation apparatus 10 according to the first embodiment described has the same configuration, and thus detailed description thereof will be omitted. In addition, the outline of the manufacturing procedure of the light-emitting module 100 of this embodiment is also the same as the image 3 The outline of the manufacturing procedure of the light-emitting module 100 according to the first embodiment described is the same, and therefore detailed description is omitted except for the content described below.
[0144] [Structure of light emitting module 100]
[0145] Figure 11 It is a sect...
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