A method for positioning glued holes without pins
A pin and glue technology, applied in the direction of printed circuit, electrical components, printed circuit manufacturing, etc., can solve the problems of time waste and efficiency reduction, and achieve the effect of reducing the scrap rate, reducing the process of returning pins, and improving product quality.
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[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
[0016] Such as Figures 1 to 2 The method of this pinless positioning adhesive drilling of the present invention shown, it comprises the following steps:
[0017] a. Substrate preliminary processing 7: select the substrate, and then make the substrate into a multi-layer board without drilling through cutting, inner layer etching and pressing processes, or make it into a multi-layer board with positioning holes through cutting and positioning drilling of double panels. Make positioning holes through the target hole of the multi-layer board or the edge of the double-sided board, as the fixing hole when the drilling machine drills.
[0018] b. Measurement 8: Use the measuring positioning ruler to measure the hole distance of the positioning holes of the above-mentioned multilay...
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