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Heat sink

A radiator and cooling fin technology, applied in the directions of radiators, indirect heat exchangers, heat transfer modification, etc., can solve the problems of poor cooling efficiency, little improvement in cooling efficiency, and difficult air circulation, so as to improve the cooling efficiency. performance, the effect of reducing the number of fins

Active Publication Date: 2017-08-18
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the number of fins is changed, an installation space corresponding to the number of fins is required
Or you can also consider reducing the distance between the fins to increase the number of fins, but because the space between the fins is narrow, the air is not easy to circulate, so the cooling efficiency is not much improved, or the cooling efficiency is deteriorated

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (Example 1, Comparative Example 1)

[0043] figure 1 It is a perspective view which shows the heat sink 10 (Example 1) of this invention.

[0044]The heat sink 10 is composed of heat receiving plates 14 , 15 , a heat receiving plate 16 , heat pipes 31 , 32 , 33 , and radiating fin portions 34 , 35 , 36 . The element 21 and the second element 22 are thermally connected respectively, the heat receiving plate 16 is thermally connected to the third element 23 disposed on the lower surface of the substrate 11, and the one ends 31a, 32a, 33a of the heat pipes 31, 32, 33 are covered by Attached to these heat receiving plates 14, 15, 16, the said heat radiation fin part 34, 35, 36 is attached to the other end part 31b, 32b, 33b side of each of these heat pipes 31, 32, 33 respectively. The radiating fin parts 34 , 35 , 36 constitute a radiating part 38 whose overall external shape is formed into a substantially cuboid shape, and each of the radiating fin parts 34 , 35 , 36 is...

Embodiment 2

[0074] Figure 5 It is a perspective view showing the heat sink 50 (Example 2) of this invention. right with figure 1 The same structures as those shown in Embodiment 1 are given the same reference numerals, and detailed descriptions are omitted.

[0075] The radiator 50 is different from the radiator 10 only in the heat dissipation fin parts 54, 55, 56 (refer to figure 1 ) of the cooling fins 34, 35, 36 (refer to figure 1 ). That is, the radiator 50 is constituted by the heat receiving plates 14 , 15 , 16 , the heat pipes 31 , 32 , 33 , and the radiating fin portions 54 , 55 , 56 . The three radiating fin parts 54 , 55 , 56 constitute a radiating part 58 whose overall shape is substantially rectangular parallelepiped, and each of the radiating fin parts 54 , 55 , 56 is composed of a plurality of fin plates 61 , 62 , 63 .

[0076]The fin plate 63 arranged on the heat pipe 33 in the center among the three heat pipes 31 , 32 , and 33 is formed in a triangular shape.

[...

experiment example

[0088] Regarding Example 1, Example 2, and Comparative Example 1 shown above, the relationship between the area and shape of the fin plate and the temperature of the element was evaluated under the following experimental conditions. Table 1 shows the evaluation results.

[0089] ·Experimental conditions

[0090] (a) Calorific value and size of components

[0091] First component: 15W, 20mm×15mm

[0092] Second component: 15W, 30mm×30mm

[0093] The third component: 25W, 20mm×20mm

[0094] A sample element in which a ceramic heater (MS-1, manufactured by Sakaguchi Electric Heating Co., Ltd.) was mounted on a copper block of the above-mentioned size was used for all measurements.

[0095] (b) Wind speed of cooling air flowing from top to bottom on each fin: 1.5m / s

[0096] (c) Thermal conductivity of thermally conductive grease between the element and the heating plate: 6W / mK

[0097] (d) Heating plate: size 30mm×30mm, plate thickness 1mm, material is nickel-plated aluminu...

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Abstract

To optimize the area of a fin plate that is provided to a heat pipe. Disclosed is a heat sink wherein: at least heat pipes 31, 32 and 33 are fixed to fin plates 41, 42 and 43, respectively; a rectangular fin plate assembled body 40 is configured from the fin plate 41, the fin plate 42, and the fin plate 43 of heat dissipating fin sections 34, 35 and 36 when the heat dissipating fin sections 34, 35 and 36 are viewed from the direction in which the heat pipes 31, 32 and 33 extend; the heat pipes 31, 32 and 33 are configured from a first heat pipe group 30A, and a second heat pipe group 30B; the first heat pipe group 30A is positioned at the center of the fin plate assembled body 40 in the longitudinal direction of the fin plate assembled body; the second heat pipe group 30B is positioned on both the sides of the first heat pipe group 30A, said both the sides being in the longitudinal direction of the fin plate assembled body 40; the fin plate 43 thermally connected to the first heat pipe group 30A is provided with expanding portions 43m and 43n.

Description

technical field [0001] The present invention relates to a heat sink in which a heat radiation fin portion is provided on a plurality of heat pipes arranged close to each other. Background technique [0002] Among heat sinks, there is known a heat sink in which cooling capacity is adjusted by changing the number of fins attached to each heat pipe (for example, refer to Patent Document 1). However, if the number of fins is changed, an installation space corresponding to the number of fins is required. Alternatively, it is conceivable to increase the number of fins by reducing the distance between the fins, but since the space between the fins is narrow, the air is not easy to circulate, so the cooling efficiency is not much improved, or the cooling efficiency is deteriorated. [0003] Regarding the heat pipes shown in Patent Document 1, for example, when adjacent heat pipes are arranged close to each other due to shape constraints, in order to adjust the cooling capacity of e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02H01L23/427
CPCF28D15/02H01L23/427H01L2924/0002F28D15/0275F28F1/30H01L2924/00F28F2215/10F28F2215/04F28F1/325F28F2013/006F28F2215/08
Inventor 平泽壮史佐佐木千佳池田匡视
Owner FURUKAWA ELECTRIC CO LTD
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