Printed board, method of manufacturing printed board, and method of joining conductive members
A manufacturing method and technology of printed substrates, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of solder bridges, inability to solder joints, easy movement, deformation, etc.
Active Publication Date: 2019-09-10
TATSUTA ELECTRICWIRE & CABLE
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- Description
- Claims
- Application Information
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Problems solved by technology
[0004] However, if the wiring is made thinner, it is easy to move and deform due to the light weight of the wiring
If such wiring is to be soldered to the substrate, the wiring will float away from the substrate and thus cannot be soldered.
In addition, if the wiring is arranged at an extremely narrow pitch, solder bridges are likely to occur
In particular, solder bridges are more likely to occur when soldering is performed by manual work such as coaxial cables.
Method used
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Embodiment Construction
[0020] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, refer to the following Figure 1 to Figure 4 , which is an embodiment of the present invention, that is, a printed circuit board, a method for manufacturing the printed circuit board, and a method for bonding conductive members will be described.
[0021] (printed substrate)
[0022] Such as figure 1 As shown, the printed circuit board 100 has a substrate 1 and a plurality of conductive junctions 2 formed on the substrate 1 . The core wire 41 of the coaxial cable 4 is connected to the upper surface (joint surface) 2 a of the conductive joint part 2 by soldering 3 .
[0023]
[0024] The conductive junctions 2 are arranged at a predetermined pitch. The upper surface 2 a of the conductive joint part 2 is a joint surface on which the core wire 41 of the coaxial cable 4 is joined. The conductive junction portion 2 is formed by performing etching treatme...
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Abstract
Soldering is performed with a high yield ratio even when extremely-thin wires are joined at an extremely-narrow pitch. Moreover, a bridge between conductive joint portions is reduced. A core wire 41 is placed on a preliminarily-soldered conductive joint portion 2. Then, the conductive joint portions 2 and the core wires 41 are covered with an optically-transparent sheet 30. Thus, the state in which the core wire 41 is placed on the conductive joint portion 2 is held. In this state, the optically-transparent sheet 30 is irradiated with light. A preliminary solder 3 is heated and melted to join the core wire 41 and the conductive joint portion 2 together.
Description
technical field [0001] The present invention relates to a printed circuit board used in mobile phones, computers, and the like, a method of manufacturing the printed circuit board, and a method of bonding conductive members. Background technique [0002] In recent years, along with miniaturization and multifunctionalization of electronic equipment, densification of circuit boards is advancing. In order to cope with this, the wiring is made very thin, and the wiring is arranged at an extremely narrow pitch. [0003] Patent Document 1: Japanese Patent No. 5479432 [0004] However, if the wiring is thinned, the wiring is easily moved and deformed due to its weight reduction. If such a wiring is to be solder-bonded to the substrate, the wiring will float away from the substrate and thus cannot be solder-bonded. In addition, if wiring is arranged at an extremely narrow pitch, solder bridges are likely to occur. In particular, solder bridges are more likely to occur when solde...
Claims
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IPC IPC(8): H05K3/34
CPCH05K3/34H05K3/3494H05K2201/10287H05K2203/0147H05K2203/0278H05K2203/107H05K3/3405H05K2203/1126B23K1/0016B23K1/005B23K2101/42H05K2203/049
Inventor 青柳庆彦川上齐德平野喜郎浦下清贵藤川良太藤尾信博
Owner TATSUTA ELECTRICWIRE & CABLE