A kind of UV photosensitive negative pure acrylic photoresist and preparation method thereof

Abstract

The invention relates to a UV photosensitive negative pure acrylic photoresist. The UV photosensitive negative pure acrylic photoresist comprises, by weight, 25 to 60% of acrylic esterified polyacrylic resin, 0.5 to 5% of a photosensitizer, 5 to 20% of an active monomer, 20 to 55% of propylene glycol methyl ether acetate, 5 to 20% of a ketone solvent and 5 to 15% of propylene glycol methyl ether. The invention also relates to a preparation method of the UV photosensitive negative pure acrylic photoresist. The UV photosensitive negative pure acrylic photoresist has the advantages of small diffraction effect, high resolution, high sensitivity, large contrast, good permeability and good anti-etching ability.

Description

technical field [0001] The invention relates to a UV photosensitive negative pure acrylic photoresist, in particular to a UV photosensitive negative pure acrylic photoresist and a preparation method thereof. Background technique [0002] In the preparation process of PCB board, photoresist is the key functional material for photolithography process. Photolithography is a precision surface processing technology that combines pattern printing and chemical etching. To put it simply, photocopying is used to transfer the pattern on the mask plate to the photoresist on the surface of the silicon wafer to achieve subsequent selective etching. It is the most important process in PCB board manufacturing, accounting for about half of the steps in circuit board manufacturing and high cost. The photoresist is particularly important as the main material in the photolithography process. Photoresists can be divided into two categories: photopolymerizable negative-working photoresists an...

AI Technical Summary

Problems solved by technology

In order to improve the resolution of the photoresist, people have been continuously improving the photoresist, but the wavelength of the ultraviolet exposure light source suitable for the existing photoresist is generally between 300 and 400nm, so the problem of low resolution is common.

[0004] Most of the photoresists used in the preparation process of PCB boards now contain inorganic fillers, and most of the inorganic fillers are powders with finer particles. A large amount of dust generated during the addition process is extremely harmful to human health.